Low-melting point metal circuit board and fabrication method thereof

Abstract

The invention provides a low-melting point metal circuit board and a fabrication method thereof, and relates to the technical field of microelectronics. The low-melting point metal circuit board comprises a stretchable flexible substrate, a low-melting point metal circuit, at least one rigid electronic component, an electronic component fixing part and a flexible package layer, wherein the low-melting point metal circuit is arranged on the flexible substrate, a pin of the right electronic component is electrically connected with the low-melting metal circuit, the electronic component fixing part at least covers an electrical connection position of the pin of the right electronic component and the low-melting point metal circuit, the flexible package layer covers one surface, where the low-melting point metal circuit, the electronic component fixing part and the rigid electronic component are arranged, of the flexible substrate, and the rigidity of the electronic component fixing part is larger than the rigidity of the flexible substrate. With the low-melting point metal circuit board provided by the technical scheme, the electrical connection position between the low-melting pointmetal circuit and the pin of the rigid electronic component can be prevented from being broken and separated during the deformation process of the low-melting metal circuit board, and the structural stability of the low-melting point metal circuit board is favorably improved.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a low-melting-point metal circuit board and a manufacturing method thereof. Background technique [0002] The melting point of low-melting-point metals is below 300 degrees Celsius, and they have the conductivity of metals, so they can be used to make circuit boards. [0003] At present, researchers have developed a variety of preparation methods for low-melting-point metal circuits, such as low-melting-point metal spraying technology, low-melting-point metal microfluidic perfusion technology, low-melting-point metal direct-write printing technology, low-melting-point metal transfer printing technology and low-melting-point metal circuit technology. Metal painting techniques, etc. All of the above technologies can be used to print low-melting-point metals on the surface of specific substrates to form low-melting-point metal circuit boards. [0004] The inventors have f...

AI Technical Summary

Problems solved by technology

[0004] The inventors have found that although the low-melting-point metal circuits on the low-melting-point metal circuit board have good stretchability and bendability, the electrical connections between the low-melting-point metal circuits and the pins of the rigid electronic components are prone to pull. Breaking and detachment during stretching or bending, resulting in open circuit, making the structural stability of the low-melting point metal circuit board poor

Images