Quad-core DSP and 1553B bus controller integrated SIP encapsulated circuit

Abstract

The invention discloses a quad-core DSP and 1553B bus controller integrated SIP encapsulated circuit. The SIP encapsulated circuit comprises a 1553B transceiver, a user I / O, a configuration PROM, an ADC, a bus drive, an FPGA, a JTAG bus, a FLASH, quad-core DSP, an EMIF bus and an SRAM, wherein the FPGA and the quad-core DSP are bidirectionally connected through the EMIF bus; the FPGA is connectedwith the quad-core DSP; the FLASH is bidirectionally connected with the FPGA and the quad-core DSP through the EMIF bus; the SRAM is bidirectionally connected with the FPGA and the quad-core DSP through the EMIF bus; the 1553B transceiver is bidirectionally connected with the FPGA; the configuration PROM is bidirectionally connected with the FPGA; the ADC is unidirectionally connected with the busdrive; and the FPGA is unidirectionally connected with the bus drive. According to the SIP encapsulated circuit, multiple element bare chips can be integrated in limited spaces, so that the volumes and weights of calculation controllers can be effectively decreased.

Description

technical field [0001] The invention relates to a SiP packaging circuit, in particular to a high-speed and large-capacity SIP packaging circuit integrating quad-core DSP, FPGA and 4M 1553B bus controller. Background technique [0002] At present, in many high-tech fields such as aerospace systems and advanced manufacturing equipment, the demand for high-performance, high-reliability, and miniaturized devices is becoming increasingly strong, especially in subdivided fields such as aircraft control, radar, and electronic countermeasures, which require components to be highly reliable. , high performance, miniaturization and other characteristics. At this stage, technologies such as SoC and SiP are usually used to meet the above requirements. However, due to the long-term foreign technology blockade and product embargo of some high-performance component products, the core technology of high-performance electronic components has long been controlled by others. At the same time,...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a SIP packaging circuit integrating quad-core DSP and 1553B bus controller, which is used to solve the problem that the computer controller cannot meet the requirements of small volume and weight in some applications

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