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Preparation method of LED lamp fluorescent powder layer

A phosphor layer, LED lamp technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced brightness of LED lamp beads, reduced conversion efficiency of phosphors, etc., to avoid absorption loss, improve brightness, and ensure quality. Effect

Inactive Publication Date: 2018-11-06
MLS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the phosphor powder is mixed and packaged, after the blue LED is excited by the yellow and green phosphor powder, the part of its emission spectrum overlapping with the red phosphor powder will excite the red phosphor powder again, resulting in a great reduction in the conversion efficiency of the yellow and green phosphor powder, and the brightness of the LED lamp bead. also decreased

Method used

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  • Preparation method of LED lamp fluorescent powder layer
  • Preparation method of LED lamp fluorescent powder layer
  • Preparation method of LED lamp fluorescent powder layer

Examples

Experimental program
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Effect test

Embodiment 1

[0027] see figure 2 , the layering process of phosphor powder described in this preferred embodiment includes the following steps:

[0028] S1. Apply phosphor glue on the outer surface of the LED chip 4, and perform centrifugal treatment on the LED chip 4, so that the phosphor in the phosphor glue is deposited on the outer surface of the LED chip 4 to form a phosphor layer , and forming a glue sealing layer on the outer surface of the phosphor layer;

[0029] specifically:

[0030] S11. Spot-coat the first phosphor glue on the outer surface of the LED chip 4, and perform centrifugal treatment on the LED chip 4, so that the first phosphor in the first phosphor glue is deposited on the outer surface of the LED chip 4. The first phosphor layer 1 wrapping the outer surface of the LED chip 4 is formed on the surface, and the first glue sealing layer is formed on the outer surface of the first phosphor layer 1 .

[0031] S12. Spot-coat the second fluorescent powder glue on the u...

Embodiment 2

[0045] In this embodiment, the specification of the selected LED lamp beads is 80Ra LED lamp beads, and the color temperature value is limited to 3000K. At this time, the mixing ratio between the amount of the selected first phosphor powder and the second phosphor powder and the glue 3 is: The mixing ratio between the first fluorescent powder and the glue 3 is 0.204:2.2, and the mixing ratio between the second fluorescent powder and the glue 3 is 3:2.2. Except for this, other requirements of the phosphor layering process in this embodiment are consistent with those in Embodiment 1, and will not be repeated here.

[0046] The preparation method of the fluorescent powder layer of the LED lamp of the present invention comprises the following steps: S1, apply fluorescent powder glue on the outer surface of the LED chip, and carry out centrifugal treatment to the LED chip, so that the fluorescent powder in the fluorescent powder glue is deposited on the The outer surface of the LED...

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Abstract

The invention provides a preparation method of an LED lamp fluorescent powder layer. The method comprises the following steps that S1, the outer surface of an LED chip is coated with fluorescent powder glue in a dispensing mode, and the LED chip is centrifuged, so that fluorescent powder in the fluorescent powder glue is deposited on the outer surface of the LED chip so as to form the fluorescentpowder layer, and a glue sealing layer is formed on the outer surface of the fluorescent powder layer; and S2, the LED chip with the fluorescent powder layer and the glue layer formed on the outer surface is subjected to curing treatment. According to the deposition process of the fluorescent powder, uniform distribution of fluorescent powder of different colors on the LED chip can be guaranteed,the situation of mixing and mutual absorption loss of different fluorescent powder are effectively avoided, the conversion efficiency of the fluorescent powder is improved, and the brightness is improved.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a method for preparing a fluorescent powder layer of an LED lamp. Background technique [0002] With the continuous advancement of LEDs in the field of lighting, the method of using blue LEDs plus phosphor packaging in the existing technology has become the main technical route of white LEDs. The traditional packaging method of white light beads is to select appropriate red, yellow or green phosphors according to the required spectrum, color rendering index and other indicators, and mix them together in different proportions. After the phosphor powder is mixed and packaged, after the blue LED is excited by the yellow and green phosphor powder, the part of its emission spectrum overlapping with the red phosphor powder will excite the red phosphor powder again, resulting in a great reduction in the conversion efficiency of the yellow and green phosphor powder, and the brightness of the...

Claims

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Application Information

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IPC IPC(8): H01L33/50
CPCH01L33/508H01L2933/0041
Inventor 刘天明陈涛许东辉刘湘丽梁艳
Owner MLS