Multi-layer high-density two-sided PCB structure

Abstract

The invention discloses a multi-layer high-density two-sided PCB structure. The structure comprises a base board and a second circuit board, wherein one side face of the base board is provided with afirst circuit board, the upper surface of the first circuit board is provided with a first copper foil board, the bottom of the first copper foil board is bonded with a first insulation board, a conductive through hole is arranged at one side inside the first circuit board, and a copper column is sheathed inside the conductive through hole. The structure is provided with the base board, a coolingsheet, a silicon rubber layer, a first cooling hole, a second cooling hole, the first circuit board and the second circuit board, the base board with heat conduction characteristic transfers heat emitted by the first circuit board and the second circuit board to the cooling sheet, the cooling sheet discharges the heat, the first circuit board and the second circuit board are internally provided with cooling holes so as to improve heat dissipation effect continuously, the cooling performance of the device is improved, and the service life of the device is prolonged.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a multi-layer high-density double-sided PCB circuit board structure. Background technique [0002] The Chinese name of PCB is printed circuit board, which is cut into a certain size with an insulating board as the base material. At least one conductive pattern is attached to it, and holes (such as component holes, fastening holes, metallized holes, etc.) To replace the chassis of the previous electronic components and realize the interconnection between electronic components. Because it is made by electronic printing, it is called a "printed" circuit board. The printed circuit board has developed from a single layer to a double layer. Surface, multi-layer and flexible, and still maintain their own development trends. Due to the continuous development in the direction of high precision, high density and high reliability, continuous reduction in size, cost reduction and perform...

AI Technical Summary

Problems solved by technology

[0003] However, the existing multi-layer high-density double-sided PCB circuit board structure has some shortcomings during use. The PCB circuit board generates heat during continuous work. If the heat is not dissipated in time, the PCB circuit board is easily damaged. The electrical connection in the board is not very connectable, which causes some troubles for the connection between electronic components. After the single board in the PCB circuit board is offset, the surface structure holes are offset, which is not convenient for electronic component assembly, and is not easy to fix, etc. shortcoming

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