Heat dissipation component and electronic device

A technology for heat dissipation components and electronic devices, applied in electrical components, electrical digital data processing, digital data processing components, etc., can solve the problems of chip power consumption, temperature rise of electronic equipment, etc., to avoid local overheating, shorten distance, prevent damage effect

Inactive Publication Date: 2018-11-09
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise.

Method used

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  • Heat dissipation component and electronic device
  • Heat dissipation component and electronic device
  • Heat dissipation component and electronic device

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0018] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-e...

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PUM

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Abstract

The invention discloses a heat dissipation component and an electronic device. The heat dissipation component comprises a circuit board, a heat source chip, a shielding case and a heat pipe, wherein the heat source chip is disposed on the circuit board; the shielding case is disposed on the circuit board and encircles the heat source chip; an insulating silica gel is filled in a shielding space formed by the shielding case; a side wall of the shielding case is provided with a via hole; an evaporation section of the heat pipe is disposed in the insulating silica gel; a condensation section extruded from the via hole and is used for discharging heat of the heat source chip. Through the abovementioned manner, on the one hand, a distance between the heat pipe and the heat source chip is shortened, and the heat can be better absorbed; on the other hand, the problem of local overheating of the electronic device is avoided and the damage of components caused by local overheating is prevented.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a heat dissipation component and an electronic device. Background technique [0002] The interior of an electronic device generally includes a control chip (ie, a core processor). With the diversification and intelligence of its functions, the requirements for the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are very common. [0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise. Contents of the invention [0004] A technical solution adopted in this application is to provide a heat dissipation assembly, which includes: a circuit board; a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/203H05K7/20336
Inventor 田汉卿
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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