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Film forming device and platen ring

A film forming device and platen technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of increasing the process and reducing the amount of Al film adhesion, and achieve the effect of preventing the film adhesion on the backside

Active Publication Date: 2020-09-08
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to remove the film adhering to the back surface, which may lead to a problem of increasing the number of steps, or a need to reduce the amount of Al film adhering to the back surface of the substrate may arise.

Method used

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  • Film forming device and platen ring
  • Film forming device and platen ring
  • Film forming device and platen ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] Next, the film forming apparatus and the platen ring according to the first embodiment of the present invention will be described based on the drawings.

[0049] figure 1 is a schematic cross-sectional view showing the film forming apparatus according to the present embodiment, and figure 1 Among them, reference numeral 10 is a film forming device.

[0050] As an example, the film forming apparatus 10 according to this embodiment is a sputtering apparatus, such as figure 1 A chamber (vacuum chamber) 11 is shown. The target 12 is arranged vertically above the inner space of the chamber 11 . In addition, a table 13 is formed below the inner space of the chamber 11 , for example, in a state of being insulated from the chamber 11 .

[0051] The upper side of the table 13 is flat, and the table 13 is used to support a film-forming object such as a circular substrate such as a silicon wafer or a rectangular substrate (film-forming object) 18 such as an FPD (Flat Panel Dis...

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Abstract

This film formation device is provided with: a chamber in which a target is contained; a stage which is disposed to face one surface of the target with a predetermined space therebetween and on which an object where a film is to be formed is placed; and a platen ring which has a facing surface facing the target and a groove formed on the facing surface, and surrounds the circumferential edge of the stage. The circumferential edge of the object placed on the stage protrudes from the circumferential edge of the stage so as to be located outside the circumferential edge of the stage, and the groove is located at a position corresponding to the circumferential edge of the object. The groove is provided around the periphery of the platen ring so that the second distance from the target to the groove is greater than the first distance from the target to the object. The groove has a curved back-surface-film-formation prevention surface which prevents film forming particles emitted from the target from depositing on the back surface of the object.

Description

technical field [0001] The present invention relates to a film forming apparatus and a platen ring, and particularly relates to an appropriate technique for preventing a film from adhering to the back surface of a substrate to be film formed during film formation such as sputtering. [0002] This application claims priority based on Patent Application No. 2016-134532 for which it applied in Japan on July 6, 2016, and uses the content here. Background technique [0003] A sputtering device is actively used in various fields of industry as a film forming device for forming a thin film on the surface of an object. In particular, in the manufacture of various electronic devices including LSIs, sputtering devices are often used to form various conductive films or insulating films. [0004] Patent Document 1 describes an example of performing Al sputtering, and Patent Document 2 describes an example of performing Cu sputtering. [0005] In recent years, the demand for rewiring A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/00C23C14/34
CPCC23C14/00C23C14/34C23C14/50C23C14/564
Inventor 坂本勇太沼田幸展小平周司
Owner ULVAC INC