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Curable organic silicon composition

A composition, silicone technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor air tightness, sulfur-containing substances corrosion, LED lamp bead light decay, etc., to reduce light decay and good air tightness. Effect

Inactive Publication Date: 2018-11-13
SUZHOU BETELY POLYMER MATERIALS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The sealing organosiloxane composition used for electronic devices can well solve the problem of weather resistance, but due to the poor airtightness of polyorganosiloxane itself, it is easily corroded by some sulfur-containing substances when used outdoors, resulting in LED lamp pearlescent decay is serious
In addition, the PCB board on the lamp also usually contains substances such as sulfur, which is very easy to corrode the LED lamp beads

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0065] Weigh 27.9 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 20.5 g of 1,3-dimethyl-1,1,3,3-tetraphenyl Phenyl disiloxane, 60g water, 1.5g concentrated sulfuric acid and 300g toluene were respectively added to the four-necked flask, stirred evenly, and slowly added dropwise 198g phenyltrimethoxysilane and 13.2g methylvinyldimethoxy For the mixture of silane, the hydrolysis temperature is controlled at 60-70°C, and after the dropwise addition, the reflux is continued for 1 hour. After cooling, the lower layer was separated and the toluene solution was washed 3-4 times with water. Then, 0.20 g of potassium hydroxide was added to the solution, and reflux was performed, and at the same time, water was removed through a water separator, and reflux was performed for 4 hours. After cooling, 0.3 g of acetic acid was added for neutralization, and the toluene solution was washed with water 3-4 times. The low boilers are removed by distillation to obtain a phenyl-type silicone res...

Synthetic example 2

[0067] Weigh 27.9 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 20.5 g of 1,3-dimethyl-1,1,3,3-tetraphenyl Phenyl disiloxane, 60g water, 1.5g concentrated sulfuric acid and 300g toluene were respectively added to the four-necked flask, stirred evenly, and slowly added dropwise 297g phenyltrimethoxysilane and 13.2g methylvinyldimethoxy For the mixture of silane, the hydrolysis temperature is controlled at 60-70°C, and after the dropwise addition, the reflux is continued for 1 hour. After cooling, the lower layer was separated and the toluene solution was washed 3-4 times with water. Then, 0.20 g of potassium hydroxide was added to the solution, and reflux was performed, and at the same time, water was removed through a water separator, and reflux was performed for 4 hours. After cooling, 0.3 g of acetic acid was added for neutralization, and the toluene solution was washed with water 3-4 times. The low boilers are removed by distillation to obtain a phenyl-type silicone res...

Synthetic example 3

[0069] Weigh 27.9 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 20.5 g of 1,3-dimethyl-1,1,3,3-tetraphenyl Phenyl disiloxane, 60g water, 1.5g concentrated sulfuric acid and 300g toluene were respectively added into four-necked flasks, stirred evenly, and slowly added dropwise 198g phenyltrimethoxysilane and 26.4g methylvinyldimethoxy For the mixture of silane, the hydrolysis temperature is controlled at 60-70°C, and after the dropwise addition, the reflux is continued for 1 hour. After cooling, the lower layer was separated and the toluene solution was washed 3-4 times with water. Then, 0.20 g of potassium hydroxide was added to the solution, and reflux was performed, and at the same time, water was removed through a water separator, and reflux was performed for 4 hours. After cooling, 0.3 g of acetic acid was added for neutralization, and the toluene solution was washed with water 3-4 times. The low boilers are removed by distillation to obtain a phenyl-type silicone resi...

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PUM

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Abstract

The invention discloses a curable organic silicon composition. The curable organic silicon composition comprises polysiloxane with the structural unit formula of (R1SiMe2O0.5)a(R22SiMeO0.5)b(R2SiO1.5)c(R1SiMeO)d, polysiloxane with the structural unit formula of (R3SiMe2O0.5)e(R4R5SiO)f, polyorganosilane with the structural unit formula of (HSiMe2O0.5)m(R62SiO)n(R7SiO1.5)p, and a hydrogen silicification reaction catalyst. The curable organic silicon composition is high in air impermeability, the anti-sulfur light attenuation can reach -2%, and the light attenuation of LED lamp beads can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of electronic potting, in particular to a curable silicone composition. Background technique [0002] The sealing organosiloxane composition for electronic devices can solve the problem of weather resistance, but due to the poor air tightness of polyorganosiloxane itself, it is easily corroded by some sulfur-containing substances when used outdoors, resulting in LED lamp beads are seriously degraded. In addition, the PCB board on the lamp also usually contains sulfur-containing substances, which are very easy to corrode the LED lamp beads. SUMMARY OF THE INVENTION [0003] The object of the present invention is to provide a curable silicone composition with high airtightness. [0004] The present invention achieves the above object through the following technical solutions: a curable organosilicon composition, comprising: [0005] The structural unit formula is (R 1 SiMe 2 O 0.5 ) a (R 2 2 SiMeO ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08G77/20C08G77/06C08G77/08H01L33/56
CPCC08G77/06C08G77/08C08G77/20C08G77/80C08L83/04C08L2203/206C08L2205/025C08L2205/03H01L33/56
Inventor 汤胜山王全欧阳旭频曾建伟
Owner SUZHOU BETELY POLYMER MATERIALS CO LTD