Semiconductor refrigeration device

Abstract

The invention discloses a semiconductor refrigeration device. The semiconductor refrigeration device comprises a box shell and an inner container arranged in the box shell. The inner container is provided with a semiconductor refrigeration module group, and the semiconductor refrigeration module group comprises a semiconductor refrigeration chip, a hot end radiator and a cold end radiator which are assembled together. The cold end radiator comprises a cold end heat conduction seat and first heat pipes connected with the cold end heat conduction seat, and the first heat pipes are attached to the inner container. The semiconductor refrigeration device is characterized in that the hot end radiator comprises a hot end heat conduction seat, second hot pipes, main heat dissipation wing pieces and an auxiliary heat dissipation seat; auxiliary heat dissipation wing pieces are formed on the auxiliary heat dissipation seat; the second hot pipes are provided with a plurality of main heat dissipation wing pieces; pipeline grooves are correspondingly formed in the relative installation faces of the hot end heat conduction seat and the auxiliary heat dissipation seat; and second heat pipe clampsare located between the hot end heat conduction seat and the auxiliary heat dissipation seat and are located in the pipeline grooves. Refrigeration efficiency improvement and energy consumption reduction of refrigeration equipment are achieved.

Description

technical field [0001] The invention relates to refrigeration equipment, in particular to a semiconductor refrigeration device. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration device, which uses the cooling capacity generated by semiconductor refrigeration chips to achieve refrigeration. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat. During operation, the cold end of the semiconductor refrigeration chip releases cold energy into the refrigeration compartment of the refrigeration device through the cold end radiator, and the semiconductor refrigeration The hot side of the chip needs to dissipate heat to the outside through the hot side heat sink. The hot-end heat sink in the above-...

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Problems solved by technology

However, in the actual operation process, it is found that although the heat pipe can quickly transfer a large amount of heat to the fins for heat dissipation, the temperature of the heat conduction seat at the hot end is still high, and the cooling speed of the heat conduction seat at the hot end is slow, resulting in low heat dissipation efficiency. Poor, which in turn causes the cooling capacity of the semiconductor cooling chip to decrease due to poor heat dissipation, and the overall energy consumption of the refrigeration equipment increases

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