Semiconductor refrigeration device

A refrigeration device and semiconductor technology, which is used in refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems such as the decline of the refrigeration capacity of the semiconductor refrigeration chip, the increase of the overall energy consumption of the refrigeration equipment, and the slow cooling speed of the heat-conducting seat at the hot end. Ensure rapid heat dissipation, reduce cooling loss, and good contact effect

Active Publication Date: 2018-11-13
QINGDAO HAIER SPECIAL ICEBOX +1
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual operation process, it is found that although the heat pipe can quickly transfer a large amount of heat to the fins for heat dissipation, the temperature of the heat conduction seat at the hot end is still high, and the cooling speed of the heat conductio

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] like Figure 1-Figure 4 As shown, the semiconductor refrigeration device in this embodiment includes a casing 200 and an inner tank 100 arranged in the casing. The inner tank 100 is configured with a semiconductor refrigeration module, and the semiconductor refrigeration module includes an assembled A semiconductor refrigera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a semiconductor refrigeration device. The semiconductor refrigeration device comprises a box shell and an inner container arranged in the box shell. The inner container is provided with a semiconductor refrigeration module group, and the semiconductor refrigeration module group comprises a semiconductor refrigeration chip, a hot end radiator and a cold end radiator which are assembled together. The cold end radiator comprises a cold end heat conduction seat and first heat pipes connected with the cold end heat conduction seat, and the first heat pipes are attached to the inner container. The semiconductor refrigeration device is characterized in that the hot end radiator comprises a hot end heat conduction seat, second hot pipes, main heat dissipation wing pieces and an auxiliary heat dissipation seat; auxiliary heat dissipation wing pieces are formed on the auxiliary heat dissipation seat; the second hot pipes are provided with a plurality of main heat dissipation wing pieces; pipeline grooves are correspondingly formed in the relative installation faces of the hot end heat conduction seat and the auxiliary heat dissipation seat; and second heat pipe clampsare located between the hot end heat conduction seat and the auxiliary heat dissipation seat and are located in the pipeline grooves. Refrigeration efficiency improvement and energy consumption reduction of refrigeration equipment are achieved.

Description

technical field [0001] The invention relates to refrigeration equipment, in particular to a semiconductor refrigeration device. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration device, which uses the cooling capacity generated by semiconductor refrigeration chips to achieve refrigeration. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat. During operation, the cold end of the semiconductor refrigeration chip releases cold energy into the refrigeration compartment of the refrigeration device through the cold end radiator, and the semiconductor refrigeration The hot side of the chip needs to dissipate heat to the outside through the hot side heat sink. The hot-end heat sink in the above-...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): F25B21/02
CPCF25B21/02F25B2321/003F25B2321/0252F25B2500/09
Inventor 慕志光王定远杨未位晓峰赵建芳胡成肖曦
Owner QINGDAO HAIER SPECIAL ICEBOX
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap