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Printed circuit board manufacturing method and printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as printed circuit board bursting, improve product reliability, alleviate mechanical impact, and protect from damage Effect

Active Publication Date: 2020-08-07
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for manufacturing a printed circuit board and the printed circuit board, which are used to solve the technical problem that the printed circuit board is likely to explode when the gong knife cuts the printed circuit board in the prior art

Method used

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  • Printed circuit board manufacturing method and printed circuit board
  • Printed circuit board manufacturing method and printed circuit board
  • Printed circuit board manufacturing method and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] The first embodiment of the present invention provides a manufacturing method of a printed circuit board. figure 1 It is a flowchart of a method for manufacturing a printed circuit board according to the first embodiment of the present invention. Such as figure 1 As shown, the method in this embodiment may include:

[0060] Step 101: Print a buffer material 4 on the gong knife path 3 on the surface of the printed circuit board.

[0061] Wherein, the gong knife path 3 may be a cutting path of the gong knife during subsequent processing of the gong knife on the printed circuit board. On the surface of the printed circuit board, a layer of buffer material 4 can be printed corresponding to the path 3 of the knife. The buffer material 4 can be a material capable of buffering, such as a buffer film or solder mask ink.

[0062] figure 2 It is a schematic diagram of the path 3 of the gong knife in the method for manufacturing a printed circuit board according to the first embodiment...

Embodiment 2

[0073] The second embodiment of the present invention provides a manufacturing method of a printed circuit board. In this embodiment, on the basis of the technical solution provided in the first embodiment, the solder resist ink is used as the buffer material.

[0074] Figure 4 It is a flow chart of the manufacturing method of the printed circuit board provided by the second embodiment of the present invention. Such as Figure 4 As shown, the method in this embodiment may include:

[0075] Step 201: Print a solder mask ink on the surface of the printed circuit board.

[0076] Step 202: Determine the gong knife path of the printed circuit board, and perform film alignment on the printed circuit board according to the gong knife path of the printed circuit board.

[0077] Step 203: Perform exposure and development operations on the printed circuit board so that the distribution of the solder mask ink is consistent with the path of the knife.

[0078] In this embodiment, steps 201 to 20...

Embodiment 3

[0088] The third embodiment of the present invention provides a method for manufacturing a printed circuit board. In this embodiment, on the basis of the technical solution provided in the first embodiment, the buffer material is intermittently arranged on the path of the gong knife.

[0089] Figure 5 This is a flowchart of a method for manufacturing a printed circuit board provided in the third embodiment of the present invention. Such as Figure 5 As shown, the method in this embodiment may include:

[0090] Step 301: Determine the gong knife path 3 of the printed circuit board.

[0091] Step 302: Print a section of buffer material 4 on the path 3 of the gong knife every predetermined distance.

[0092] In this embodiment, the buffer material 4 can be printed on the gong knife path 3 on the surface of the printed circuit board through steps 301 to 302.

[0093] The method for determining the path 3 of the gong knife belongs to the prior art and will not be repeated here. After the...

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Abstract

The invention provides a printed circuit board manufacturing method and a printed circuit board; the method comprises the following steps: printing a buffer material on a router bit path on the PCB surface; using a high temperature to bake the buffer material, and enabling the buffer material to attach to the PCB surface; processing a routing process on the PCB along the router bit path printed with the buffer material. The printed circuit board manufacturing method and the printed circuit board print the buffer material on the router bit path of the PCB surface, bake the buffer material at high temperature, enable the buffer material to attach to the PCB surface, and route the PCB along the router bit path printed with the buffer material, thus alleviating a machinery impact of the routing router bit, protecting the PCB from being harmed, effectively reducing PCB popping or layering frequency in routing segmentation, and improving the product reliability.

Description

Technical field [0001] The invention relates to a printed circuit board technology, in particular to a manufacturing method of a printed circuit board and a printed circuit board. Background technique [0002] Printed Circuit Board (PCB) is a carrier for electrical connection of electronic components. Due to the consistency of similar printed boards, the use of printed circuit boards in electronic equipment can effectively avoid manual wiring errors, and can realize automatic insertion or placement of electronic components, automatic soldering, and automatic detection, ensuring the quality of electronic equipment and improving Improve production efficiency, reduce costs, and facilitate maintenance. [0003] In the production process of printed circuit boards, in order to improve production efficiency, usually according to the size and specifications of the printed circuit board, many printed circuit boards are designed on one board for multiple processing. The printed circuit boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0271H05K3/0044H05K2201/2045H05K2203/0228
Inventor 江民权
Owner NEW FOUNDER HLDG DEV LLC
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