Semiconductor wafer grinding equipment

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and specifically discloses semiconductor wafer grinding equipment. The semiconductor wafer grinding equipment comprises a grinding sheet, a grinding frame, a grinding disc and a clamping device, wherein the clamping device comprises a fixing block, hinge baffles, first air springs, a clamping block and a connection block,and a first rectangular groove is formed in one side of the fixing block; one end of each first air spring is hinged to the opening of the first rectangular groove; the other end of each first air spring is fixedly connected with one end of the corresponding hinge baffle; the other end of one hinge baffle and the other end of the other hinge baffle are mutually hinged; and the clamping block andthe hinge baffles are oppositely arranged, the bottom of one end of the clamping block is hinged to a shoulder at one end of the connection block, and the top of one end of the clamping block is connected with the top of one end of the connection block through a spring. According to the semiconductor wafer grinding equipment, a second air spring is arranged below an elastic compression sheet, thesecond air spring compresses an elastic swing sheet, and clamping for a wafer is realized through the co-action of the second air spring and the spring; and moreover, a soft and reliable clamping force is achieved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer grinding device. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but the requirements for material technology and production technology are higher, such as uniformity and so on. In wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, photolithography ...

AI Technical Summary

Problems solved by technology

However, in this scheme, the way of clamping the wafer on the grinding disc is not convenient for taking out the wafer, thus affecting the processing efficiency; the wafer can slide in the placement groove during grinding, which affects the grinding quality of the wafer surface; when grinding wafers with different diameters The grinding disc needs to be replaced, which takes a long time to change the model and affects the processing efficiency

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