A kind of semiconductor wafer grinding equipment
A semiconductor and wafer technology, which is applied in the field of semiconductor wafer grinding equipment, can solve the problems of affecting processing efficiency, long changeover time, inconvenient wafer removal, etc., to ensure reliability, high clamping efficiency, and soft clamping force Effect
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[0023] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0024] Such as Figure 1 to Figure 4As shown, a kind of semiconductor wafer grinding equipment described in the present invention includes a grinding sheet 1, a grinding frame 2, a grinding disc 3, and a clamping device 4. The grinding sheet 1 is arranged above the grinding frame 2, and the grinding sheet 1 can Realize moving up and down; the grinding frame 2 is provided with a grinding disc 3; the grinding disc 3 is driven to rotate by a motor, and a group of clamping devices 4 are arranged on the upper end of the grinding disc 3; the clamping device 4 is used for clamping when grinding Holding the wafer, the clamping device 4 is radially arranged on the upper surface of the grinding disc 3; the clamping device 4 includes a fixed block 41, a hing...
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