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A kind of semiconductor wafer grinding equipment

A semiconductor and wafer technology, which is applied in the field of semiconductor wafer grinding equipment, can solve the problems of affecting processing efficiency, long changeover time, inconvenient wafer removal, etc., to ensure reliability, high clamping efficiency, and soft clamping force Effect

Active Publication Date: 2020-02-14
NANTONG RUISEN OPTICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this scheme, the way of clamping the wafer on the grinding disc is not convenient for taking out the wafer, thus affecting the processing efficiency; the wafer can slide in the placement groove during grinding, which affects the grinding quality of the wafer surface; when grinding wafers with different diameters The grinding disc needs to be replaced, which takes a long time to change the model and affects the processing efficiency

Method used

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  • A kind of semiconductor wafer grinding equipment
  • A kind of semiconductor wafer grinding equipment
  • A kind of semiconductor wafer grinding equipment

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Embodiment Construction

[0023] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0024] Such as Figure 1 to Figure 4As shown, a kind of semiconductor wafer grinding equipment described in the present invention includes a grinding sheet 1, a grinding frame 2, a grinding disc 3, and a clamping device 4. The grinding sheet 1 is arranged above the grinding frame 2, and the grinding sheet 1 can Realize moving up and down; the grinding frame 2 is provided with a grinding disc 3; the grinding disc 3 is driven to rotate by a motor, and a group of clamping devices 4 are arranged on the upper end of the grinding disc 3; the clamping device 4 is used for clamping when grinding Holding the wafer, the clamping device 4 is radially arranged on the upper surface of the grinding disc 3; the clamping device 4 includes a fixed block 41, a hing...

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PUM

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Abstract

The invention belongs to the technical field of semiconductor manufacturing, and specifically discloses semiconductor wafer grinding equipment. The semiconductor wafer grinding equipment comprises a grinding sheet, a grinding frame, a grinding disc and a clamping device, wherein the clamping device comprises a fixing block, hinge baffles, first air springs, a clamping block and a connection block,and a first rectangular groove is formed in one side of the fixing block; one end of each first air spring is hinged to the opening of the first rectangular groove; the other end of each first air spring is fixedly connected with one end of the corresponding hinge baffle; the other end of one hinge baffle and the other end of the other hinge baffle are mutually hinged; and the clamping block andthe hinge baffles are oppositely arranged, the bottom of one end of the clamping block is hinged to a shoulder at one end of the connection block, and the top of one end of the clamping block is connected with the top of one end of the connection block through a spring. According to the semiconductor wafer grinding equipment, a second air spring is arranged below an elastic compression sheet, thesecond air spring compresses an elastic swing sheet, and clamping for a wafer is realized through the co-action of the second air spring and the spring; and moreover, a soft and reliable clamping force is achieved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer grinding device. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but the requirements for material technology and production technology are higher, such as uniformity and so on. In wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, photolithography ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/30B24B37/10B24B7/22
CPCB24B7/228B24B37/10B24B37/30
Inventor 王青
Owner NANTONG RUISEN OPTICAL CO LTD
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