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Optical switch chip

A technology of optical switch and optical switch matrix, which is applied in the field of communication, can solve the problems of long waveguide traces, large insertion loss of optical switch chips, etc., and achieve the effect of reducing structural complexity

Active Publication Date: 2018-11-23
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides an optical switch chip, which is used to solve the problem of excessive insertion loss of the optical switch chip caused by too long waveguide wiring between the side coupler of the optical switch chip and the single polarization matrix switch in the prior art and the presence of cross waveguides. The problem

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Embodiment Construction

[0052] The optical switch chip provided by this application can be applied to figure 1 The network system shown ( figure 1 It is a schematic diagram of the network structure provided by the embodiment of this application). Such as figure 1 As shown, the network system includes a backbone network, a metropolitan area network, a data center, etc., and each of these networks includes a plurality of nodes, and the optical switch chip provided by this application can be applied to these nodes for optical signal exchange. exist figure 1 The optical switch chip provided by the present application can be applied to node 1, node 2, node 3, node 4, node 5, node 6, node 7, and node 8. For example, for node 4, applying the optical switch chip provided by this application to this node can realize the optical signal exchange between the backbone network and the metropolitan area network. For node 8, applying the optical switch chip provided by this application to this node can realize t...

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Abstract

The application provides an optical switch chip. The optical switch chip includes a first device layer, a second device layer, and a first bottom layer; the first device layer is connected with the first bottom layer; an optical switch matrix, N optical coupling devices, and a plurality of electrodes are disposed on each of the first device layer and the second device layer; the first device layerand the second device layer are bonded together by means of the vertical soldering of the plurality of electrodes of the first device layer and the plurality of electrodes of the second device layer;and the positions of the N optical coupling devices of the first device layer on the first device layer are identical with the positions of the N optical coupling devices of the second device layer on the second device layer. According to the optical switch chip of the invention, the two device layers of the same structure are bonded together, an optical fiber can be coupled at the same portion of the optical switch chip, and coupled light can directly enter the optical switch matrixes of the two device layers, and therefore, long waveguide wires and cross-waveguides can be avoided, and the insertion loss of the optical switch chip will not be increased.

Description

technical field [0001] The present application relates to communication technology, in particular to an optical switch chip. Background technique [0002] With the development of the communication network, higher requirements are put forward for the transmission rate and communication quality of the communication network. Compared with traditional communication networks, all-optical switching has the advantages of low energy consumption and large capacity, so it will become the development direction of broadband communication in the future. Among them, the optical switch matrix is ​​the key equipment to realize important functions such as routing selection, wavelength selection, and optical cross-connection in all-optical switching of future optical networks. An optical switch chip with a built-in optical switch matrix is ​​set on a node device of a communication network to realize an all-optical switching function. [0003] In the prior art, the optical switch chip is cou...

Claims

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Application Information

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IPC IPC(8): G02B6/35
CPCG02B6/354
Inventor 赵飞
Owner HUAWEI TECH CO LTD