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Power semiconductor module for a motor vehicle and motor vehicle

A technology for power semiconductors and motor vehicles, applied in semiconductor devices, semiconductor/solid-state device parts, electric vehicles, etc., can solve problems such as hindering heat transfer, and achieve low cost and effective cooling

Inactive Publication Date: 2018-11-23
AUDI AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the thermal coupling of the power semiconductor chip to the heat sink is only possible via long heat transfer paths from the power semiconductor chip via a substrate / carrier plate formed, for example, of plastic, of a ceramic matrix or of another carrier material, such as ceramic Substrate and thermal pad or thermal paste up to the heat sink, which adversely hinders heat transfer

Method used

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  • Power semiconductor module for a motor vehicle and motor vehicle
  • Power semiconductor module for a motor vehicle and motor vehicle
  • Power semiconductor module for a motor vehicle and motor vehicle

Examples

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Embodiment Construction

[0022] figure 1 A schematic diagram of a first exemplary embodiment of a power semiconductor module 1 is shown, comprising a housing 2 with a first housing part 3 and a second housing part 4 .

[0023] A plurality of power semiconductor chips 6 arranged on a carrier element 5 without a housing, for example IGBTs or power-chips designed as bare chips with associated freewheeling diodes, are accommodated in the first housing part 3 . MOSFETs. The power semiconductor chips 6 are shown purely schematically and are connected as a bridge circuit, for example a half bridge or a B6 bridge. The first housing part 3 also has a coolant supply line 7 , by means of which an electrically insulating coolant 8 is poured into the liquid-tightly closed interior of the first housing part 3 . The cooling fluid 8 thus flows directly around the power semiconductor chip 6 without housing and thus dissipates the heat generated by the power semiconductor chip during operation. To discharge the cool...

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PUM

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Abstract

The invention relates to a power semiconductor module for a motor vehicle. A plurality of unhoused power semiconductor chips(6) are provided, which are arranged so that a liquid coolant(8) that is introduced into the power semiconductor module(1) through a liquid coolant feed line(7) can circulate directly around them.

Description

technical field [0001] The invention relates to a power semiconductor module for a motor vehicle and to a motor vehicle. Background technique [0002] Power semiconductor modules in motor vehicles typically have a plurality of power semiconductor chips and are used as switching units for converters, for example rectifiers or pulse inverters. In partially or completely electrically driven motor vehicles, power semiconductor modules can be used, for example, to generate a multiphase alternating current from the output voltage of the high-voltage battery or to convert the alternating current into a direct charging voltage for the high-voltage battery. In this case, the power semiconductor chips generate considerable heat and must be cooled in order to avoid damage. [0003] Power semiconductor chips are known which are arranged on a heat sink / cooling body, which is designed, for example, as a solid metal block, in particular made of aluminum, and which has, for example, drille...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/473
CPCH01L23/473H01L25/072H01M2220/20H01M10/625H01M10/6567B60L15/007H01L2924/13055H01L2924/13091B60L58/20H05K7/20927H01L23/44B60L50/60Y02T10/64Y02T10/70Y02E60/10H01L23/373H01L25/18H05K7/20936
Inventor R·施特拉塞尔
Owner AUDI AG
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