Interconnection line structure, display substrate and manufacturing method thereof, and display device

A technology for a display substrate and a manufacturing method, which is applied in the fields of display devices, display substrates and their manufacturing methods, and interconnection structure, and can solve problems such as failure of flexible display devices and easy breakage of interconnection wires, so as to improve mechanical reliability and good performance. The effect of ductility and good electrical conductivity

Inactive Publication Date: 2018-11-27
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the interconnect structure of the flexible display device is easily broken, resulting in the failure of the flexible display device.

Method used

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  • Interconnection line structure, display substrate and manufacturing method thereof, and display device
  • Interconnection line structure, display substrate and manufacturing method thereof, and display device
  • Interconnection line structure, display substrate and manufacturing method thereof, and display device

Examples

Experimental program
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Effect test

Embodiment Construction

[0028] It has been mentioned in the background art that the interconnection structure of the flexible display device is easily broken, resulting in failure of the flexible display device. The inventors found that this is because metal wires (such as gold wires, silver wires or copper wires) are usually used to form the interconnect structure, and the distribution of the metal wires is diversified, such as the pattern of the metal wires is a straight line One or more of shape, arc shape, V-shape, wherein, the included angle of the V-shape can be a right angle, an obtuse angle or an acute angle.

[0029] figure 1 It is a top view structure diagram of a display substrate in a flexible display device. like figure 1 As shown, the display substrate includes a flexible substrate 10 and an interconnection structure 11 formed on the flexible substrate 10. The pattern of the metal lines of the interconnection structure 11 is distributed in a V shape, that is, the interconnection struc...

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PUM

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Abstract

The invention discloses an interconnection line structure, a display substrate and a manufacturing method thereof, and a display device. The interconnection line structure is provided with a first region and a second region interconnected with each other, the stress of the second region is greater than the stress of the first region, the first region comprises a conductive line, and the second region comprises a nanometer metal wire. The nanometer metal wire not only has good electrical conductivity, but also has good ductility (bending resistance), therefore, the nanometer metal wire is not easy to be broken during the process of being bent, so that the mechanical reliability of the interconnection line structure can be effectively improved. Thereby, the reliability of the display devicecan be improved by applying the display substrate including the interconnection line structure to the display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an interconnect structure, a display substrate and a manufacturing method thereof, and a display device. Background technique [0002] Flexible display devices have their own powerful advantages, such as easy to carry, bendable, and can be deformed at will. At present, flexible display technology is becoming more and more mature, flexible screens will gradually enter people's lives, and flexible mobile devices will gradually become The main tool of daily life, the industry predicts that flexible mobile devices will gradually replace traditional mobile devices (mobile phones, tablets, etc.) in the near future. [0003] In flexible display devices, the interconnection structure is one of the core structures in flexible display devices, such as the interconnection structure of thin film transistor array electrodes, the interconnection structure of organic light-emitting layer elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L27/32H01L23/532H01L21/768B82Y30/00
CPCH01L23/53209H01L27/1244H01L27/1259H01L21/76838B82Y30/00H10K59/131H10K59/1201H05K1/118H05K2201/0145H05K2201/015H05K2201/0154H05K2201/09272H05K2201/09263H05K2201/026H01L23/4985H01L23/49838Y02E10/549Y02P70/50H10K2102/311H01L21/768H01L23/528H05K1/0283H05K2201/10128H10K71/00H10K77/111
Inventor 胡坤李亚龙乔贵洲
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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