DOPO type curing agent for epoxy resin system and application of DOPO type curing agent
An epoxy resin system, epoxy resin technology, applied in DOPO type compound D-DICY and its application field in epoxy resin system, can solve the problem of lack of flame retardant performance, and achieve the effect of good compatibility
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[0032] The synthetic method of compound D-DICY, concrete steps are as follows:
[0033] Under an inert atmosphere, add an appropriate amount of DOPO into the reaction flask and heat until the DOPO is completely melted, then add an appropriate amount of dicyandiamide into the reaction flask to form a mixture, and the reaction temperature is higher than 110 ° C to ensure that the mixture is in a molten state, and then The temperature was raised to 175°C, and the reaction was carried out for 6-12 hours. The reaction product was washed and filtered with tetrahydrofuran to remove unreacted DOPO, then washed with hot deionized water and dried in a vacuum oven to obtain the final product.
[0034] The H NMR spectrum of the product is attached figure 2 shown. From the analysis in Table 1, it can be confirmed that the obtained product is D-DICY.
[0035] Table 1
[0036]
Embodiment 1
[0038] The application method of novel compound D-DICY in epoxy resin, its specific steps are as follows:
[0039] 1. Select epoxy resin CYD127, mix it with 10wt% compound D-DICY, 1wt% DMP-30 or imidazole (all in terms of epoxy resin mass, the same below) and filler;
[0040] 2. Pour the above mixed solution into a self-made silicone mold, heat it to 100°C for 1 hour to pre-cure, and make it into shape;
[0041] 3. Heat the mixture to 115°C for 4 hours, so that the curing agent can fully cure the epoxy resin, and then continue to heat up to 135°C and cure for 2 hours, so as to eliminate internal stress and improve the bonding strength and the comprehensive performance of the epoxy resin cured product.
[0042] Mechanism of Curing Epoxy Resin Using D-DICY See figure 1 . Under appropriate conditions, the primary amino group on D-DICY first reacts with the epoxy group, the epoxy group ring-opens and reacts to form a hydroxyl group, the primary amine loses an active H to form a ...
Embodiment 2
[0044] 1. Select epoxy resin E51, mix it with 15wt% compound D-DICY, 3wt% DMP-30 or imidazole and filler;
[0045] 2. Pour the above mixture into a self-made silicone mold, heat to 100°C for 2 hours to pre-cure, and make it into shape; heat up to 115°C for 4 hours, and continue to heat up to 135°C for 2 hours.
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