Cutting device for wafer etching equipment

Abstract

The invention relates to the technical field of an accessory device for processing and production of a wafer flowing piece, in particular to a cutting device for wafer etching equipment. By the cutting device, a potential risk can be reduced, the stability of a silicon crystal post during the cutting process is improved, the cutting accuracy is improved, the cutting efficiency is improved, and theapplication limitation is reduced; moreover, a loosen conveying belt can be tensioned and adjusted during the long-term application process of the conveying belt, the transmission efficiency is improved, and the application reliability is improved. The cutting device comprises an operating plate, four groups of legs, a rear side plate, a cutting motor, the conveying belt, a diamond cutting piece,a left limitation plate, a right limitation plate, a left sliding plate, a right sliding plate, a top plate, an adjustment lead screw, a driving motor, two groups of left upper guide wheels, two groups of left lower guide wheels, two groups of right upper guide wheels, two groups of right lower guide wheels, two groups of locking bolts, an upper fixed plate, a lower fixed plate, a left fixed plate, a right fixed plate, a threaded pipe, a threaded rod, an adjustment plate and a tension wheel, wherein dovetail sliding grooves are formed in a left side and a right side of a middle part of the rear side plate.

Description

technical field [0001] The invention relates to the technical field of wafer tape-out processing and production attachments, in particular to a cutting device for wafer etching equipment. Background technique [0002] As we all know, the wafer is the carrier used in the production of integrated circuits. It refers to single-crystal silicon wafers. The cutting device used for wafer etching equipment is a method for cutting silicon crystal columns for better processing to obtain silicon wafers. Auxiliary device, which has been widely used in the field of wafer tape-out processing and production; the existing cutting device for wafer etching equipment includes an operation board, four sets of legs, rear side board, cutting motor, transmission Belt and diamond cutting blade, the bottom end of the rear side plate is connected with the top rear side of the operation board, and the tops of the four sets of outriggers are respectively connected with the left front side, left rear si...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned technical problems, the present invention provides a method to reduce potential safety hazards, improve the stability of the silicon crystal column during the rising and moving cutting process, improve the cutting accuracy, and solve the problem that the silicon crystal column cannot be cut at one time due to the small cutting diameter of the diamond cutting blade. problems, improve the cutting effect, and reduce the limitations of use; and during the long-term use of the transmission belt, the tension of the loose transmission belt can be adjusted to improve the transmission effect and improve the reliability of the wafer etching equipment. cutting device

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