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Flux

A technology of flux and surfactant, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of inability to spread evenly, unable to form solder bumps, damage to soldering reliability, etc. , to achieve a good effect of infiltration and spreading

Active Publication Date: 2018-12-07
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the metal core post is mounted on the substrate, if the wetting and spreading of the flux is insufficient, the removal of the oxide film cannot be sufficiently performed, and the solder is only spread on the part that can be removed, and it cannot be spread evenly
If the solder is not evenly spread, the metal core collapses or moves, and the solder bump cannot be formed at the desired position on the electrode part.
When the solder bump cannot be formed at the desired position of the electrode part, it becomes a cause of poor soldering reliability such as poor electrical conduction

Method used

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  • Flux
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The flux of Example 1 contains: 20% by mass of an organic acid, 3% by mass of imidazole as an amine, and N,N,N',N",N"-penta(2-hydroxypropyl)diethylene as an amine 20% by mass of triamine, 7% by mass of amino-terminated PEG-PPG copolymer as amine, 3% by mass of polyoxyethylene alkylamine as surfactant, 15% by mass of polyethylene glycol as base, solvent 32% by mass. With the flux of Example 1, good results were obtained, such as a contact angle of 12.2 degrees and a zero-crossing time of 1.12 seconds.

Embodiment 2

[0054] The flux of Example 2 contains: 20% by mass of organic acid, 3% by mass of imidazole, 7% by mass of diethanolamine as an amine, N,N,N',N",N"-penta(2-hydroxypropyl) di 20% by mass of ethylenetriamine, 3% by mass of polyoxyethylene alkylamine, 15% by mass of polyethylene glycol, and 32% by mass of solvent. The flux of Example 2 was able to obtain good results of a contact angle of 12.9 degrees and a zero-crossing time of 1.05 seconds.

Embodiment 3

[0055] The flux of Example 3 contains: 20% by mass of an organic acid, 3% by mass of 2-methylimidazole as an amine, N,N,N',N",N"-penta(2-hydroxypropyl)diethylene 20% by mass of triamine, 7% by mass of amino-terminated PEG-PPG copolymer, 3% by mass of polyoxyethylene alkylamine, 15% by mass of polyethylene glycol, and 32% by mass of solvent. The flux of Example 3 was able to obtain good results of a contact angle of 12.1 degrees and a zero-crossing time of 1.1 seconds.

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Abstract

The present invention provides a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 DEG C for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more thanzero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 DEG C in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the bakedCu plate onto which the flux is applied into a Sn-3.0 Ag-0.5 Cu alloy at a dipping speed of 15 mm / sec and by 2.0 mm of a dipped depth.

Description

technical field [0001] The present invention relates to fluxes containing surfactants. Background technique [0002] In general, the flux used in soldering chemically removes the metal oxides existing on the solder alloy and the metal surface of the soldering object to be joined, and the metal element can be mixed between the two. Borders move. Therefore, by performing soldering with a flux, an intermetallic compound is formed between the solder alloy and the metal surface of the object to be joined, and a strong joint can be obtained. [0003] In recent years, due to the miniaturization of electronic components soldered using flux, the soldering portion of the electronic component, that is, the narrowing of the electrode pitch has progressed. When forming solder bumps on narrow electrode portions, metal core pillars obtained by covering columnar metal cores with solder are gradually being used instead of spherical solder. [0004] A general method of mounting a metal pil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362B23K35/26B23K35/262B23K35/3613B23K35/3615B23K35/3616B23K35/3618
Inventor 丸子大介高桥淳美须藤皓纪川崎浩由服部贵洋六本木贵弘相马大辅萩原崇史佐藤勇川又勇司
Owner SENJU METAL IND CO LTD
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