High-strength bus duct and manufacturing method thereof

A bus duct, high-strength technology, applied in the field of bus duct, can solve the problems of ground fault, easy to cause accidents, reduced current carrying capacity, etc., achieve good insulation performance and fire resistance, avoid accidents, and facilitate heat dissipation.

Active Publication Date: 2018-12-07
荣马电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is that the heat generation of the traditional busway structure cannot be monitored, which will cause insulation reduction, current carrying capacity reduction, and even breakdown short circuit or ground fault, which is very easy to cause accidents

Method used

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  • High-strength bus duct and manufacturing method thereof

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Embodiment Construction

[0024] A high-strength bus duct and its preparation method provided by this embodiment, the structure is as follows figure 1 shown.

[0025] The high-strength busway includes a shell composed of a side plate 1 and a cover plate 2. A number of grooves 3 are opened on the outside of the side plate 1, and a bimetallic sheet 4 is arranged in the groove 3. The bimetallic sheet 4 includes a deformed part 42 and the connecting part 41 located at both ends, the connecting part 41 is hinged with the side wall of the groove 3, and the bimetal sheet 4 is a composite material composed of two or more metals or other materials with suitable properties. The thermal expansion coefficients of the component layers are different. When the temperature changes, the deformation of the active layer is greater than that of the passive layer, so that the whole of the bimetal sheet 4 will bend to the side of the passive layer, and the curvature of the composite material will change. produce deformatio...

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PUM

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Abstract

The invention discloses a high-strength bus duct and a manufacturing method thereof and relates to the technical field of a bus duct. The bus duct comprises a casing composed of a side board and a cover board, wherein an outer side of the side board is provided with multiple grooves, the grooves are internally provided with dual-metal pieces, the dual-metal pieces respectively comprise a deformation portion arranged at the middle and connection portions arranged at two ends, the connection portions are hinged with side walls of the grooves, in a normal temperature state, the dual-metal piecesare completely in the grooves, when the temperature of the side board reaches the preset value, the deformation portions are outside the grooves. The bus duct is advantaged in that the dual-metal pieces can be used to remind the staff that the temperature in the bus duct is too high, so timely measures are taken, and accidents are avoided.

Description

technical field [0001] The invention relates to the technical field of bus ducts, in particular to a high-strength bus duct and a preparation method thereof. Background technique [0002] In the prior art, the busway structure is usually composed of side plates and cover plates, which are used to install conductors. Due to the poor heat dissipation of the traditional busway structure when the line is energized, if the screws are not tightened when they are overlapped or overloaded It is easy to generate heat. If the heat cannot be monitored, it will cause insulation reduction, current carrying capacity reduction, and even breakdown short circuit or ground fault, which will easily lead to accidents. Contents of the invention [0003] The technical problem to be solved by the present invention is that the heat generation of the traditional busway structure cannot be monitored, which will cause a decrease in insulation, a decrease in carrying capacity, and even a breakdown sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G5/06H02G5/10C08L63/00C08L67/00C08K13/04C08K7/14C08K3/36C08K3/22
CPCC08K2003/2251C08L63/00C08L2203/20H02G5/06H02G5/10C08L67/00C08K13/04C08K7/14C08K3/36C08K3/22
Inventor 李银生常加军许伟王星王伟常鑫倪文龙陈明张万荣陆燕赵开封
Owner 荣马电器有限公司
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