A composite reinforced solder and its preparation method

Abstract

The invention belongs to the field of composite solder, and particularly relates to a composite reinforced solder and a preparation method thereof. The composite type reinforced solder is composed ofSiC reinforced particles and the balance of matrix alloy; the SiC reinforcing particles are SiC particles modified by silver plating; and the mass fraction of SiC particles in the solder is 0.2-1% ofthe mass of the matrix alloy. The preparation method of the solder comprises the following steps of preparing silver-plated SiC particles; drying, grinding and storing; taking a matrix alloy, and smelting; preparing silver-plated SiC particle slurry; fully mixing the silver-plated sic particle slurry with the matrix alloy; and casting and forming. According to the composite reinforced solder, theyield strength of the welding spots can be obviously improved, the creep resistance and the anti-fatigue performance are improved, the service life of the electronic device is prolonged, and the electronic device can be suitable for large-scale production of enterprises.

Description

technical field [0001] The invention belongs to the field of composite solder, and in particular relates to a preparation method of composite reinforced solder. Background technique [0002] With the gradual miniaturization of electronic products and the intensive assembly of electronic components, electronic packaging technology is also facing more and more challenges. In electronic packaging technology, the reliability of solder joints has always been one of the core issues in the design and use of electronic products. On the one hand, solder joints can be used as electronic signal transmission channels, and at the same time, they also form a mechanical connection between the chip and the substrate and play a role in heat conduction. During the service process, solder joints are accompanied by thermal and mechanical stress cycles, and are prone to failure behaviors such as creep and fatigue, which in turn affect the service life of electronic products. Some people mix si...

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Problems solved by technology

However, the common external addition method is to modify the surface of SiC particles and directly add them to the matrix alloy, and simply use mechanical stirring, ultrasonic stirring or electromagnetic stirring to mix, so it is difficult to achieve the fusion of the external particles and the matrix alloy, because the molten solder and SiC particles There is always an oxide film on the surface that hinders the contact and fusion of the two. Directly adding SiC particles will lead to unsatisfactory yield strength and creep resistance of the strengthened solder.

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