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Flow blocking structure of pcb board and manufacturing method of pcb board

A PCB board and flow blocking technology, which is applied in the field of PCB board processing, can solve the problems of not being able to effectively control the flow rate of resin, and achieve the effects of improving yield, ensuring uniformity, and slowing down the flow of resin to the outside of the board

Active Publication Date: 2020-06-19
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flow-blocking structure of a PCB board, aiming to solve the technical problem that the flow-guiding method in the prior art cannot effectively control the speed of resin flow glue

Method used

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  • Flow blocking structure of pcb board and manufacturing method of pcb board
  • Flow blocking structure of pcb board and manufacturing method of pcb board
  • Flow blocking structure of pcb board and manufacturing method of pcb board

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0032] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the referred device Or ele...

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PUM

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Abstract

The invention is applicable to the technical field of PCB processing, the invention provides a current blocking structure of a PCB board and a manufacturing method of the PCB board, The current blocking structure of the PCB board comprises a plurality of current blocking units nested in each other, each current blocking unit comprises N current blocking bars distributed in a rotational symmetry, Nis an integer greater than or equal to 3, each current blocking bar comprises a first bar portion and a second bar portion, and the first bar portion and the second bar portion are inclined connectedat an angle; One of the flow blocking strips of the other flow blocking unit is nested between two adjacent flow blocking strips of the flow blocking unit, and a rubber guide channel is formed between the flow blocking strips. The invention forms a continuous and tortuous glue guide channel by nesting a plurality of flow blocking monomers, The speed of resin flowing glue can be effectively controlled in the hot pressing process, which has the effect of slowing down the resin flowing out of the board, ensuring that the resin flowing glue is fully filled into the glue guide channel, thus ensuring the uniformity of the thickness of the pressing medium layer, and improving the yield of PCB manufacture.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and in particular relates to a flow-blocking structure of a PCB board and a manufacturing method of the PCB board. Background technique [0002] With the continuous development of the electronics industry, there are more and more needs and higher requirements for high-voltage and high-current printed circuit boards (PCBs) in the fields of industrial equipment and electronic communications. The application of multi-layer PCB boards is also increasing, and the board edge of the PCB board is used to meet the process requirements of each manufacturing process and the positioning requirements of machinery and equipment. At present, the thickness of the PCB of electronic products is getting thinner and thinner, and the thickness of the dielectric layer between the core boards of the multilayer PCB board is also getting thinner. The thickness control tolerance of the existing pressing medi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00H05K3/06
CPCH05K1/0272H05K3/0058H05K3/06H05K2201/2027
Inventor 肖安云王俊陆玉婷付风奇甘元利许海燕
Owner SHENZHEN KINWONG ELECTRONICS