A semiconductor integrated circuit wafer processing production line and its production and processing method

Abstract

The invention relates to a semiconductor integrated circuit wafer processing production line and a production and processing method thereof. The semiconductor integrated circuit wafer processing production line comprises a bottom plate, wherein edge grinding devices are installed at the middle part of the upper end of the bottom plate, movable electric sliders are symmetrically installed on the front and rear sides of the bottom plate, lifting adjusting cylinders are installed on the movable electric sliders, the top ends of the lifting adjusting cylinders are installed on a lifting driven plate through flanges, a slicing device is installed on the lifting driven plate, and the slicing device is positioned directly above the edge grinding devices. According to the semiconductor integratedcircuit wafer processing production line and the production and processing method thereof, the problems in the prior silicon crystal rod slicing and edging process that cut wafers need to be manuallytransported to a designated position for edging processing, the processing of the silicon crystal rod slicing is not accurately controlled manually, the wafers are prone to being injured by mistake inthe conveying process, the wafers cannot be normally used due to mutual collision during the wafers conveying process, the edging of the wafers takes a long time manually with the aid of the prior instrument and multiple wafers cannot be processed at the same time are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit processing, in particular to a semiconductor integrated circuit wafer processing production line and a production and processing method thereof. Background technique [0002] Wafers are the main material of semiconductor integrated circuits. Wafers are made of silicon ingots. In the process of silicon ingots processing wafers, silicon ingot slicing and wafer edge grinding are two very important processes. The silicon ingot is cut into wafers, and then the burrs in the wafer cutting are edged. However, in the existing silicon ingot slicing and edging process, the cut wafers need to be manually transported to a designated position for edging. Manual control of silicon ingot slicing processing is not accurate, and the specifications of the wafers cannot be guaranteed. The burrs on the surface of the cut wafers are sharp, and it is easy to accidentally injure them during the t...

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Problems solved by technology

[0003] In order to solve the above problems, the present invention provides a semiconductor integrated circuit wafer processing production line and its production and processing method, which can solve the existing silicon ingot slicing and edging process, which requires manual transport of the cut wafers to designated The edge grinding process is carried out at the position, the manual control of the silicon ingot slicing process is not accurate, and the specification of the wafer cannot be guaranteed. Collision with each other will also cause the wafer to be unable to use normally. It takes a long time to grind the edge of the wafer manually with the existing equipment, and it is impossible to process multiple wafers at the same time. The labor intensity is high, the operation is complicated, and the work efficiency is low. It can be realized. The intelligent continuous operation function of ingot slicing and edging processing does not require manual operation, and has the advantages of saving time, simple operation, low labor intensity and high work efficiency.

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