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SOT-89/223-2L lead frame and preparation method of two-pin structure

A 1.SOT-89, 2.SOT-89 technology, applied in the field of preparation of SOT-89/223-2L lead frame and two-leg structure, can solve problems such as circuit failure, ignition or short circuit, and improve reliability. performance, reduce investment, and broaden the scope of application

Pending Publication Date: 2018-12-14
JIANGSU JIEJIE MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing SOT-89 / 223-2L products include plastic package body, heat sink, left lead pin, right lead pin and middle lead pin. Leave the middle pin with a length of 0.5-1.0mm, and the distance between the remaining middle pin and the left and right pins is small. When the device is working, it will cause ignition or short circuit due to voltage ≥ 1500V, resulting in early circuit failure.

Method used

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Embodiment Construction

[0021] The invention provides a method for realizing the SOT-89 / 223-2L lead frame and the two-leg structure. Through the special frame structure design, the plastic sealing mold can be compatible with SOT-89 / 223-3L and SOT-89 / 223-2L during plastic sealing For products with two structures, the middle lead pins of SOT-89 / 223-2L products are completely encapsulated in the plastic package after plastic sealing, and the middle lead pins that play the role of plastic sealing on the frame are cut off by the mold during glueing, and the middle lead pins of the SOT-89 / 223-2L product The 0.1mm length of molding compound is left at the middle lead pin of the 223-2L product, which doubles the lead pitch of the device and improves the reliability of the device.

[0022] Such as figure 1 As shown, the SOT-89 / 223-2L lead frame and two-leg structure include a plastic package body 1, a lead frame 11 is set inside the plastic package body 1, a heat sink 2 is drawn out from one side of the plast...

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Abstract

The invention discloses a SOT-89 / 223-2L packaging lead frame and a manufacture method of a two-pin product, changes a traditional method of three-pin cutting to realize two-pin packaging, realizes a two-pin packaging structure, and the middle pin is not exposed, increases the insulation distance between the left and right pins, and widens the application range of the device. The SOT-89 / 223-2L packaging lead frame and two-pin product include a lead frame, a Heat dissipation fin, a cut-off type middle pin and left and right lead pins, no exposed copper point exists at the middle pin of the two-pin product, and the heat dissipation fin and the middle pin adopts a rib cutting implementation method of structural design of cutting at a plastic package line position, so that the device has no ignition or short circuit phenomenon when the voltage is equal to or higher than 1500V during operation, thereby improving the reliability of the device.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a SOT-89 / 223-2L lead frame and a preparation method for a bipod structure, including multi-row structures such as 6 rows, 8 rows, and 12 rows. Background technique [0002] Existing SOT-89 / 223-2L products include plastic package body, heat sink, left lead pin, right lead pin and middle lead pin. Leave the middle pin with a length of 0.5-1.0mm, and the distance between the remaining middle pin and the left and right pins is small. When the device is working, it will cause ignition or short circuit due to voltage ≥ 1500V, resulting in early circuit failure. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a SOT-89 / 223-2L lead frame and two-leg structure, including a plastic package body, a lead frame is arranged in the plastic package body, a heat sink is drawn out from one side of the plastic package body, and a ...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/31H01L21/56
CPCH01L21/56H01L23/3107H01L23/49541H01L2924/181H01L2224/48091H01L2224/48247H01L2924/00014H01L2924/00012
Inventor 徐洋严巧成管钱健龚天宇
Owner JIANGSU JIEJIE MICROELECTRONICS
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