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Spectral cutting device and material loading work table thereof

A cutting device and worktable technology, applied in manufacturing tools, laser welding equipment, metal processing equipment, etc., can solve problems such as large product differences, large cutting errors, and inability to ensure product cutting accuracy, so as to improve processing efficiency and ensure The effect of machining accuracy

Inactive Publication Date: 2018-12-18
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The cutting equipment currently on the market are all single-station cutting equipment. With the development of laser technology, some people try to realize multi-station cutting by means of light splitting. However, multi-station cutting will have a large Cutting error, the processed products are very different, and the cutting accuracy of the product cannot be guaranteed

Method used

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  • Spectral cutting device and material loading work table thereof
  • Spectral cutting device and material loading work table thereof

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Embodiment Construction

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and similar expressions are used herein for the purpose of descripti...

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Abstract

The invention relates to a spectral cutting device and a material loading work table thereof. The material loading work table comprises at least two material loading positions. The material loading positions are provided with corresponding material loading fixtures and locating structures respectively; the material loading fixtures are used for loading workpieces, the locating structures are usedfor abutting against edges of the workpieces so that the workpieces on the material loading fixtures can be located; the material loading work table is further provided with a adjustment mechanism which is used for adjusting relative rotation angle between the material loading fixtures, and thus the work pieces loaded on the material loading fixtures are distributed on the material loading work table at a preset angle. According to the spectral cutting device and the material loading work table thereof, the material loading work table is provided with the adjustment mechanism to adjust the material loading fixtures on the material loading work table, so that the material loading fixtures are distributed on a work table at the preset angle to make placements between the work pieces consistent when the work pieces on the material loading fixtures are producing, and thus improvement of production efficiency by synchronous processing is achieved, and meanwhile accuracy of production is assured.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, and in particular relates to a light splitting cutting device and a material loading workbench thereof. Background technique [0002] The cutting equipment currently on the market are all single-station cutting equipment. With the development of laser technology, some people try to realize multi-station cutting by means of light splitting. However, multi-station cutting will have a large Cutting error, the processed products are very different, and the cutting accuracy of the product cannot be guaranteed. Contents of the invention [0003] Based on this, it is necessary to provide a spectroscopic cutting device and a loading workbench thereof that can improve cutting efficiency and ensure cutting precision. [0004] A loading workbench, comprising at least two loading positions, the loading positions are respectively provided with corresponding loading jigs and positioning structures; th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/702
Inventor 黄磊陈鹏飞杨晓晖宋威李子博章炬孙杰尹建刚高云峰
Owner HANS LASER TECH IND GRP CO LTD
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