Manufacturing method and PCB of groove bottom pattern stepped groove
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DONGGUAN SHENGYI ELECTRONICS
- Publication Date
- 2020-01-17
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Abstract
Description
technical field
[0001] Embodiments of the present invention relate to the technical field of printed circuit boards, in particular to a method for manufacturing a stepped groove with a groove bottom pattern and a PCB. Background technique
[0002] With the advancement of science and technology, electronic products have become indispensable daily necessities in people's lives, and PCB (Printed Circuit Board, printed circuit board) is an important part of electronic products. In recent years, people have more and more functional requirements for electronic products. The more it is, the higher the requirements are for the PCB.
[0003] Due to its special structure and electrical properties, stepped grooves are widely used in three-dimensional three-dimensional assembly, reducing the assembly volume of electrical equipment, and special electrical properties. At present, there are various manufacturing methods for stepped groove circuit boards, but for The method of making the g...