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A method of making a stepped groove

A manufacturing method and a stepped groove technology are applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., which can solve the problems of poor versatility, complicated manufacturing process, and difficult manufacturing, and achieve strong versatility, simplify the manufacturing process, The effect of reducing the difficulty of production

Active Publication Date: 2021-04-23
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing stepped grooves, which overcomes the defects of complex manufacturing process, difficult manufacturing and poor versatility in the prior art.

Method used

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  • A method of making a stepped groove
  • A method of making a stepped groove
  • A method of making a stepped groove

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Experimental program
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Effect test

Embodiment Construction

[0041] The manufacturing method of the stepped groove provided by the present invention, the main idea is:

[0042] Making a copper foil with a preset circuit pattern; the copper foil includes at least a first area, the first area is consistent with the area of ​​the groove bottom of the stepped groove to be made, and the preset circuit pattern is formed in the first area;

[0043] Perform groove processing on the first designated core board and designated prepreg to be formed into the tank body, and perform copper removal treatment on the groove bottom area of ​​the second designated core board at the bottom of the tank;

[0044] Stack each layer of core board and each layer of prepreg in sequence;

[0045] Aligning the first area of ​​the copper foil to the bottom area of ​​the groove;

[0046] Pressing at high temperature causes the first area of ​​the copper foil to bond to the bottom area of ​​the groove to form a stepped groove with a preset circuit pattern at the botto...

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Abstract

The present invention relates to the technical field of PCB, and discloses a step groove manufacturing method, comprising: manufacturing copper foil with a preset circuit pattern, the copper foil includes a first area and a second area surrounding the first area, the first The area is consistent with the area of ​​the groove bottom of the stepped groove to be made, and the preset circuit pattern is formed in the first region; the first specified core board and the specified prepreg to be formed into the groove body are grooved, and the second Designate the groove bottom area of ​​the core board to remove copper layer; stack each layer of core board and each layer of prepreg in sequence, and align the first area of ​​copper foil with the bottom area of ​​the groove; press to make the first layer of copper foil The area is bonded to the bottom area of ​​the groove to form a stepped groove with the predetermined circuit pattern on the bottom of the groove. Compared with the traditional method, the embodiment of the present invention greatly simplifies the manufacturing process, reduces the manufacturing difficulty, has no design restrictions, and has strong versatility.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a stepped groove. Background technique [0002] Due to its special structure and electrical properties, the stepped groove has a wide range of applications in three-dimensional three-dimensional assembly, reducing the assembly volume of electrical equipment, and special electrical properties. [0003] At present, there are various methods of manufacturing printed circuit boards, but for stepped grooves with non-metallized side walls, the usual manufacturing method is: first make groove bottom graphics on the core board / sub-board at the bottom of the groove, and then make Ladder slot. This manufacturing method has the following defects: since the groove bottom pattern is made first, the groove bottom pattern needs to be protected before the subsequent step groove is made, resulting in a long and complicated pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/40H05K3/46
CPCH05K1/119H05K3/403H05K3/46H05K2201/09645H05K2201/09845
Inventor 刘梦茹纪成光陈正清
Owner DONGGUAN SHENGYI ELECTRONICS
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