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Resin sealing device

A resin sealing device and resin sealing technology, which are applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of different resin sealing thicknesses, high storage costs, and mold frame manufacturing costs, etc. The effect of improving work efficiency and improving accuracy

Active Publication Date: 2018-12-21
ASAHI ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Or, depending on the thickness of the semiconductor package of the electronic component, sometimes the thickness of the required resin sealing is different
[0011] In such a situation, there are many kinds of mold frames according to the kind of electronic components, the kind of packaging of electronic components, etc., which has many disadvantages in terms of cost.
The reason is that not only the manufacturing cost of the formwork becomes high, but also the storage cost may become very high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0105] (overview)

[0106] First, an overview of the resin sealing device according to Embodiment 1 will be described. figure 1 It is a front view of the resin sealing device according to Embodiment 1 of the present invention. figure 2 It is a front view of the resin sealing device according to Embodiment 1 of the present invention. figure 1 A state in which the movable cavity described later is in the initial position (position before movement), figure 2 A state in which the movable cavity is lowered according to the sealed space 4 is shown.

[0107] The resin sealing device 1 includes a first frame 2 , a second frame 3 , a sealed space 4 , a movable cavity 5 , a determination unit 6 , a control unit 7 , and a resin injection unit 8 . In addition, the resin sealing device 1 seals the object 10 to be sealed with resin. As an example of the sealing object 10, in figure 1 , figure 2 Among them, the member on which the semiconductor element 11 is mounted on the electr...

Embodiment approach 2

[0204] Next, Embodiment 2 will be described. In Embodiment 2, position correction of the movable cavity 5 will be described.

[0205] (Position correction of movable cavity)

[0206] As described in Embodiment 1, the movable cavity 5 returns to its original position (initial position) after moving to apply pressure to the resin. By returning the movable cavity 5 to the initial position, the resin sealing process can be continuously performed on the next object to be sealed 10 . For example, figure 2 A state in which the movable cavity 5 is moving downward is shown. figure 1 The state where the movable cavity 5 is in the initial position before moving downward is shown. Thus, in figure 1 state, also shows the figure 2 The movable cavity 5 is returned to the initial position after the pressurization by the downward movement is completed.

[0207] Here, there may be a case where the movable cavity 5 does not return to the initial position after pressurization, but stay...

Embodiment approach 3

[0218] Next, Embodiment 3 will be described. In Embodiment 3, a case where a resin sheet is used as the resin forming the resin sealing layer 41 will be described. In Embodiments 1 and 2, the resin is injected into the sealed space 4 from the resin injection port 8 . The resin sealing layer 41 is formed by pressurizing the movable cavity 5 with respect to the injected resin.

[0219] In the resin sealing device 1 according to Embodiment 3, the resin is not injected from the resin injection port 8 , but the resin sheet is placed on the object 10 to be sealed. The movable cavity 5 applies pressure to the set resin sheet to form the resin sealing layer 41 .

[0220] Figure 8 It is a front view of a resin sealing device according to Embodiment 3 of the present invention.

[0221] exist Figure 8 In the resin sealing device 1 described above, a resin sheet 40 is provided in the sealed space 4 . At this time, since the movable cavity 5 is configured to move from above to belo...

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PUM

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Abstract

A resin sealing device for an electronic element, wherein the resin sealing device is provided with a first form and / or a second form for forming a sealing space around an article to be sealed, the device being made to operate according to an operating condition determined on the basis of: a logical relational expression indicating a correlational relationship for determining, on the basis of a logical element, the operating conditions of a movable cavity that can move vertically inside the sealing space; and an actual measurement relational expression for indicating a correlation for determining the operating conditions of the movable cavity on the basis of the actual measurement results of a molded article in which the forming of the resin sealing layer has been completed. Pressure is applied to the resin inside the sealing space, whereby resin sealing can be accurately performed at the requisite thickness in correspondence with differences in the thickness of the resin sealing.

Description

technical field [0001] The present invention relates to a resin sealing device for sealing an electronic component mounted on a substrate with a resin, and more particularly to a resin sealing device capable of coping with the possibility that the thickness of the resin to be sealed may vary. Background technique [0002] Many electronic devices, measuring devices, electrical devices, transmission devices include electronic substrates for processing electrical signals. Many electronic components such as semiconductor elements and integrated circuits are mounted on these electronic substrates. A single semiconductor element, a semiconductor integrated element such as a microprocessor, or a power element using a high voltage, etc. are mounted on an electronic substrate as an electronic element. [0003] Electronic boards on which electronic components are mounted are accommodated in electronic equipment, measuring equipment, and the like to be operated. At this time, among t...

Claims

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Application Information

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IPC IPC(8): H01L21/56B29C45/14
CPCB29C45/14H01L21/56H01L21/565H01L21/67126
Inventor 石井正明
Owner ASAHI ENG CO LTD
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