Artificial cochlea implant chip function test platform

A cochlear implant and functional testing technology, applied in the electronic field, can solve the problems of not being able to test all distances, low precision, complicated operation, etc., and achieve the effect of convenient and comprehensive testing, easy operation, and high testing accuracy

Pending Publication Date: 2018-12-28
SHANGHAI HUALING ARTIFICIAL EAR MEDICAL TECH
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AI Technical Summary

Problems solved by technology

[0003] The existing test plan is to directly place the transmitting coil on the receiving circuit board, separated by a wooden board with a fixed distance in the middle, and the wooden board needs to be replaced every time the test distance changes, and the transmitting coil is re-placed, but this method takes a long time and is complicated to operate. The accuracy is not high, can not test all distances between 3-12mm

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  • Artificial cochlea implant chip function test platform
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Embodiment Construction

[0033] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.

[0034] Such as Figure 1-Figure 2 As shown, a cochlear implant chip functional testing platform includes a base 11, an experimental platform 9, a three-axis calibration mechanism, a transmitting coil fixing seat 5, a positioning mechanism for a chip to be tested, a vernier caliper 4, a test signal transmitter 13, Sampling resistance circuit board 10 and computer 14, wherein, experimental platform 9 is fixed on the base 11; Triaxial calibration mechanism is fixed on the base 11, and is positioned at one end of experimental platform 9; Transmitting coil holder 5 is used for fixing trans...

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Abstract

The invention relates to an artificial cochlea implant chip function test platform. The artificial cochlea implant chip function test platform comprises a base, a test platform fixed on the base, a three-axis calibration mechanism which is fixed on the base and is arranged at one end portion of the test platform, a transmitting coil fixing seat which is used for fixing a transmitting coil and is connected with the three-axis calibration mechanism through a switching board, a to-be-tested chip positioning mechanism which is arranged on the test platform and is used for fixing a to-be-tested chip, a vernier caliper which is arranged on the test platform and is used for measuring the distance between a receiving coil and the transmitting coil of the to-be-tested chip, a test signal transmitter used for connecting with the transmitting coil, a sampling resistance circuit board used for connecting with the to-be-tested chip, and a computer used for testing discharging performance and reading backward read resistance, wherein the position of the transmitting coil fixing seat is adjusted through rotation of the three-axis calibration mechanism. Compared with the prior art, the artificialcochlea implant chip function test platform has advantages of compact structure, convenient installation, more accurate and reliable operation, and the like.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a cochlear implant chip function testing platform. Background technique [0002] A cochlear implant is an electronic device that converts sound into electrical signals in a certain coded form by an external speech processor, and directly excites the auditory nerve through the electrode system implanted in the body to restore, improve and rebuild the auditory function of the deaf. Over the past two decades, with the development of high technology, cochlear implants have progressed rapidly, and have entered clinical application from experimental research. During the processing of the cochlear implant, it is necessary to solder the chip on the ceramic substrate and then package and cover it. The entire processing process is complex and irreversible. If there is a problem with the chip later, there is no way to dismantle the card and reprocess it, and it needs to be scrapped. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61N1/372
CPCA61N1/37235
Inventor 周勇高娜吴拥真贾贤浩陈巧灵
Owner SHANGHAI HUALING ARTIFICIAL EAR MEDICAL TECH
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