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Laser micro-hole processing method for dynamically adjusting multiple focuses

A technology of microhole processing and laser processing, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem that it is difficult to meet the processing requirements of high efficiency, high quality and high depth-to-diameter ratio of microholes, and limit the efficiency of microhole processing It can process micro-hole depth-to-diameter ratio and lack of flexibility in laser processing methods to achieve the effect of improving micro-hole processing depth-to-diameter ratio and processing efficiency, improving micro-hole depth-to-diameter ratio and processing quality, and improving micro-hole processing efficiency.

Active Publication Date: 2019-01-04
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, there are mainly the following problems: 1. With the increase of the microhole processing depth, the loss of laser energy and the difficult-to-spray material slag limit the microhole processing efficiency and the depth-to-diameter ratio of the machinable microholes; 2. , With the diversification of materials and microhole processing requirements, the lack of flexible laser processing methods makes it difficult to meet the processing requirements of high efficiency, high quality, and high depth-to-diameter ratio for microholes

Method used

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  • Laser micro-hole processing method for dynamically adjusting multiple focuses
  • Laser micro-hole processing method for dynamically adjusting multiple focuses
  • Laser micro-hole processing method for dynamically adjusting multiple focuses

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Embodiment 1

[0025] This embodiment provides a laser microhole processing method with dynamic adjustment of multi-focus. An ultrafast laser with a pulse width of 290 fs and a power of 10 W is used to process silicon nitride ceramic microholes with a thickness of 5 mm and an aperture of 200 μm. The surface of the silicon nitride ceramic workpiece 9 to be processed is ground and polished, fixed on the working platform 10, and the working platform 10 is moved so that the silicon nitride ceramic workpiece 9 is located under the laser processing system. Before laser processing, turn on the laser processing system and use the third focusing mirror 7 to complete the laser focusing on the surface of the silicon nitride ceramic workpiece 9, then turn off the laser processing system. During laser processing, the silicon nitride ceramic workpiece 9 is first moved and the micro-hole processing area 8 is selected to be located below the dynamic focusing lens group 14 of the laser processing system, and ...

Embodiment 2

[0027] This embodiment provides a laser microhole processing method with dynamic adjustment of multi-focus. An ultrafast laser with a pulse width of 10 ps and a power of 20 W is used to process alumina ceramic microholes with a thickness of 3 mm and an aperture of 100 μm. The surface of the alumina ceramic workpiece 9 to be processed is ground and polished, fixed on the working platform 10, and the working platform 10 is moved so that the alumina ceramic workpiece 9 is located under the laser processing system. Before laser processing, turn on the laser processing system and use the third focusing mirror 7 to complete the laser focusing on the surface of the alumina ceramic workpiece 9, then turn off the laser processing system. During laser processing, the alumina ceramic workpiece 9 is first moved and the micro-hole processing area 8 is selected to be located under the dynamic focusing lens group 14 of the laser processing system, and then the laser processing system is turne...

Embodiment 3

[0029]This embodiment provides a laser microhole processing method with dynamic adjustment of multi-focus. An ultrafast laser with a pulse width of 290 fs and a power of 10 W is used to process silicon nitride ceramic microholes with a thickness of 5 mm and an aperture of 200 μm. The surface of the silicon nitride ceramic workpiece 9 to be processed is ground and polished, fixed on the working platform 10, and the working platform 10 is moved so that the silicon nitride ceramic workpiece 9 is located under the laser processing system. Before laser processing, turn on the laser processing system and use the third focusing mirror 7 to complete the laser focusing on the surface of the silicon nitride ceramic workpiece 9, then turn off the laser processing system. During laser processing, the silicon nitride ceramic workpiece 9 is first moved and the micro-hole processing area 8 is selected to be located below the dynamic focusing lens group 14 of the laser processing system, and t...

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Abstract

The invention provides a laser micro-hole processing method for dynamically adjusting multiple focuses. The laser micro-hole processing method comprises the following steps of grinding and polishing the surface of a workpiece, fixing the workpiece to a working platform, and completing laser focusing on the surface of the workpiece before laser processing; in the laser processing process, moving the workpiece firstly, and selecting a micro-hole processing area located under a dynamic focusing lens group of a laser processing system; enabling laser beams to sequentially enter the dynamic focusing lens group to form the multiple focuses in the micro-hole processing area of the workpiece; and enabling all focusing mirrors in the dynamic focusing lens group to move in the X and Y directions toadjust the number of the focuses and the relative positions of focusing, and then completing micro-hole processing. According to the laser micro-hole processing method, the at least two focusing mirrors are introduced to form the multiple focuses in the micro-hole processing area of the material, the relative positions of the at least two focusing mirrors can be dynamically adjusted to achieve theadjustable diameter and focal length of focused spots, the micro-hole processing efficiency can be improved, and meanwhile, the machinable micro-hole depth-to-diameter ratio and processing quality are improved.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser microhole processing method for dynamically adjusting multi-focus. Background technique [0002] Laser micro-hole processing technology can quickly remove materials through the focused high-energy laser beam without tool wear. It has advantages that traditional processing technologies cannot match. It has been widely used in aerospace, electronic information, rail transportation and other fields, and has developed rapidly. As the depth of microhole processing increases, the energy loss of the laser and the difficult-to-remove slag remaining in the microhole severely limit the efficiency of microhole processing and the ratio of the depth to diameter of the microhole that can be processed. Ordinary focused single-focus laser processing technology It has been unable to meet the ever-increasing requirements of micro-hole processing. The emergence of new ...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/064
CPCB23K26/0648B23K26/382
Inventor 王成勇王宏建唐梓敏郑李娟杜策之胡小月黄欣吴茂忠
Owner GUANGDONG UNIV OF TECH
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