A soft flexible board with high reliability and an assembly fixture thereof

Abstract

The invention relates to a soft flexible board with high reliability and an assembly fixture thereof, comprising a soft flexible board body, a main via region and a standard pad region are arrange onthat soft flexible board body, a group of electrical networks correspond to the electrical networks of optical device pins to be fabricated or tested is arranged in the main via region, and a group ofstandard pads correspond to the electrical networks of the main via are arranged in the standard pad region. The soft flexible board body further comprises a test pad region, wherein the test pad region is arranged between the main via region and the standard pad region; A set of test pads corresponding to the standard pad electrical network is provided in the test pad area. The invention has thebeneficial effects that: by increasing the butt joint tolerance between the circuit board pad and the test pad, the poor butt joint or even misalignment of the soft flexible board body and the circuit board pad is not easy to occur when the test is carried out, so that the reliability and the yield of the optical device in the test process are improved.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a high-reliability flexible soft board and an assembly fixture thereof. Background technique [0002] In modern communications, low power consumption, high density, and integration have become the development trend of optoelectronic devices and even communication modules. In the case of limited space and volume, flexible boards can be bent and folded freely, and can be freely arranged and arranged according to layout requirements. Stretchable and has good heat dissipation characteristics, the use of flexible boards in communication modules can effectively achieve dense assembly and connection of modules. [0003] However, the existing flexible board and its assembly have the following problems: [0004] With the development trend of high integration of optoelectronic devices and communication modules, the size stipulated by industry standards is getting smaller and...

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Problems solved by technology

[0004] With the development trend of high integration of optoelectronic devices and communication modules, the size stipulated by industry standards is getting smaller and smaller, the size of flexible boards is also getting smaller and smaller, and the pads are getting denser; and in order to obtain higher density performance and electromagnetic shielding performance, single-layer boards are gradually developing into multi-layer boards. In this way, in the process of manufacturing and testing optoelectronic devices and modules, due to the dense pads of flexible boards, it is inevitable that flexible boards and test circuits will appear. If the pad connection of the board is poorly connected or even misplaced and press-fitted, once the power is supplied, there is a high probability that it will damage the optoelectronic device and module being manufactured or tested; and because the flexibility of the multilayer board is much lower than that of the single In the multi-process production and testing of modules, repeated positioning and assembly will cause damage to the flexible board, which not only affects the appearance, but also affects the performance. As a result, products using flexible boards must be replaced with new flexible boards at high temperatures before they are sold. In the process, it is easy to cause damage to the product again and cause failure. Due to the above defects in the flexible board with high-density pads and its press-fitting method, the optoelectronic devices and communication modules are damaged or invalid during the manufacturing and testing process, and the defect rate increases. high

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