Laser rotary-cutting marking method for surface of hard and brittle material

A hard and brittle material, laser marking machine technology, applied in the direction of laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of material cracking, affecting the clarity of marking, etc., to avoid cracking, good marking effect, good effect clear effect

Active Publication Date: 2019-01-11
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The cost of fiber laser marking machine is low, and it has been widely used in plastics, steel and other materials. However, when fiber laser marking machine is used for laser marking on glass, ceramics and other hard and Stress gradient, the laser marking area on the surface of hard and brittle materials is easy to form microcracks, these cracks perpendicular to the laser moving direction will form new cracks, expand to the area near the original mark to form fragments, when the line width of the notch is small, These micro-cracks and chips can seriously affect the legibility of markings and in severe cases even crack the material

Method used

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  • Laser rotary-cutting marking method for surface of hard and brittle material

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Embodiment

[0015] In this example, the laser is a pulsed fiber laser, the single pulse energy of the laser is 1mj, the frequency is 20KHZ, the pulse width of the laser beam is 10ns, the wavelength is 1064nm, the laser spot diameter is 0.05mm, the scanning speed is 1m / s, and the hard and brittle material is nitrogen Silicon. The shape of the character is number 2, and the width W is 0.14 mm. Specific steps are as follows:

[0016] Step 1: Determine the fitting path 4 of laser marking as the number "2";

[0017] Step 2: According to the laser spot diameter and the character width, the number of rotary cutting paths scanned by the laser is n=3, the radius R1 of the rotary cutting path 1 is 0.025mm, the radius R2 of the rotary cutting path 2 is 0.075mm, and the rotary cutting path 3 The radius R3 is 0.125mm, and the distance between adjacent rotary cutting paths is 0.05mm.

[0018] Step 3: Make the laser beam of the laser marking machine complete the first rotary-cutting path combination ...

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Abstract

The invention relates to the field of surface treatment, in particular to a laser rotary-cutting marking method for a surface of a hard and brittle material. Laser marking is performed by the aid of pulse fiber laser, so that the edge of the marking line has the relatively high definition; laser marking is performed with a rotary cutting method, the phenomenon of edge cracking can be avoided in the whole laser marking process, and thus the marking definition is guaranteed, and fracture of the hard and brittle material is avoided; a round is formed by every time of rotary cutting, and reflections of light in various directions are identical, so that the clear marking effect can be observed in different directions; no more than 3 rotary cutting paths are adopted in a unit, so that marked patterns or characters can be filled sufficiently, and the marking effect is good; and the distance between every two adjacent rotary cutting paths is d, a clear separating line can be formed between every two adjacent rotary cutting paths, the matte effect can be produced under illumination, and the marking definition can be further improved.

Description

technical field [0001] The invention relates to the field of surface treatment, in particular to a laser rotary cutting marking method on the surface of hard and brittle materials. Background technique [0002] The cost of fiber laser marking machine is low, and it has been widely used in plastics, steel and other materials. However, when fiber laser marking machine is used for laser marking on glass, ceramics and other hard and Stress gradient, the laser marking area on the surface of hard and brittle materials is easy to form microcracks, these cracks perpendicular to the laser moving direction will form new cracks, expand to the area near the original mark to form fragments, when the line width of the notch is small, These micro-cracks and chips can seriously affect the legibility of markings and in severe cases even crack the material. Therefore, it is necessary to develop a new fiber laser marking process for hard and brittle materials. Contents of the invention [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/362B23K26/361B23K26/70B23K26/702
Inventor 戴峰泽田勇
Owner JIANGSU UNIV
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