Procuring process of welding glue

A pre-curing and process technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of high resistance, easy short circuit, insufficient bonding strength, etc.

Inactive Publication Date: 2019-01-11
昆山建皇光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding strength of the welding adhesive currently on the market is not high enough, the resistance is high and it is easy to short circuit under extreme conditions.

Method used

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  • Procuring process of welding glue
  • Procuring process of welding glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10

[0032] Process the product according to the conditions in Table 1, and use the product obtained by the non-pre-curing process as a control example to test the peel strength, impedance and width. If the width of the glue is not more than 0.1mm, it means pass:

[0033] Table 1

[0034]

[0035] It can be seen from Table 1 that the electronic products obtained by this process can meet the requirements of 0.1mm ultra-fine electrode spacing; and the peel strength fully meets the standard requirements of 3kgF, even above 6kgF; at the same time, the impedance is lower than the design requirements of 5Ω, even reaching 2.4Ω. It shows that this process can fully meet the requirements of conductive structure, connection and conduction.

[0036] The feature of the present invention is that the liquid glue is converted into a semi-solidified state through pre-curing, which is good for handling without splashing, can be fully filled, is good for adhesion and bonding, does not splash, is...

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Abstract

The invention belongs to the technical field of manufacturing of electronic parts and components and relates to a procuring process of welding glue. The procuring process comprises the following steps: freezing the welding glue at -20 DEG C; taking out the welding glue, and standing at 25 DEG C for 2 hours so as to form a fluid with moderate viscidity; injecting the welding glue fluid into glue dispensing equipment; dispensing the welding glue fluid to gluing seams of a product with the length of 20mm+ / -1mm in a speed of 0.6mg / s+ / -0.05mg / s; baking at 50-70 DEG C; carrying out hot-pressing at ahigh temperature, so as to completely cure the welding glue; and after the hot-pressing, carrying out discharging and packaging on the welding glue. According to the process, the characteristics of the glue can be adequately utilized, and the tight combination between a high-strength bonding effect and high-frequency conduction is realized through measures of glue dispensing, baking, hot-pressingand the like.

Description

technical field [0001] The invention relates to the technical field of electronic component manufacturing, in particular to a pre-cured solder paste process. Background technique [0002] With the rapid development of the electronics industry, in order to improve the strength and overflow of the joints, a hot-melt adhesive is generally used for the connection between PCB and FPC of some electronic products, and it also needs to be easy to operate. However, the traditional method uses a kind of hot melt adhesive. The hot melt adhesive has poor high-frequency conduction and the bonding will produce cavities that are difficult to control and easy to fall off. In particular, the performance effect is poor, and it is easy to cause high-frequency failure. [0003] With the rapid development of electronic technology and the popularization and use of welding technology, more and more electronic products now use tin with better conductivity in order to save assembly space, better fix...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/06C09J163/00C09J133/04C09J161/06C09J9/02C09J11/04C09J11/06
CPCC08L2205/025C08L2205/035C09J5/06C09J9/02C09J11/04C09J11/06C09J163/00C09J2301/314C09J2301/50C09J2463/00C08L33/04C08L63/00C08L61/06C08K13/02C08K3/08C08K3/36C08K5/092
Inventor 朱昀小菅正邵亚逢彭杰杨建锋
Owner 昆山建皇光电科技有限公司
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