Circuit board heat-dissipating simulation component
A technology of circuit boards and printed circuit boards, which is applied in the direction of electronic circuit testing, measuring electricity, measuring electrical variables, etc., can solve the problem of low data reliability and achieve the effect of real and effective simulation data
Active Publication Date: 2019-01-11
CRRC DALIAN R & D CO LTD
View PDF10 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The embodiment of the present invention provides a circuit board heat dissipation simulation component to overcome the problem that the simulated data needs to be selected according to experience and the data reliability is low
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, those skilled in the art have obtained it without making creative efforts.
[0049] figure 1 A schematic structural diagram of a circuit board heat dissipation simulation component provided by an embodiment of the present invention. Such as figure 1 As shown, the assembly includes: a frame 10, a front panel 20, a rear panel 30 and a base 40, wherein
[0050] One end of the frame 10 is connected to the base 40, and the other end is provided with an air outlet 11;
[0051] The first side wall 12 of ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the invention provides a circuit board heat-dissipating simulation component. The circuit board heat-dissipating simulation component comprises a frame, a front panel, a rear panel and a base. One end of the frame is connected with the base, and an air outlet is formed in the other end of the frame. A first opening is formed in the first side wall of the frame. A second opening is formed in the second side wall of the frame. The first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating a printed circuit board. The frontpanel and the first side wall are detachably connected, and the front panel can be arranged on the first opening in a covering mode. A temperature measuring hole corresponding to a heating device on the front face of the printed circuit board is formed in the front panel. The rear panel and the second side wall are detachably connected, and the rear panel can be arranged on the second opening in acovering mode. The rear panel is provided with a temperature measuring hole corresponding to a heating device on the back face of the printed circuit board. A fan is arranged in the base and used forblowing generated air out from the air outlet. The circuit board heat-dissipating simulation component can achieve physical simulation and is high in data reliability.
Description
technical field [0001] The invention relates to the technical field of circuit simulation, in particular to a circuit board heat dissipation simulation component. Background technique [0002] With the development of semiconductor technology, the integration of circuits is getting higher and higher, and the volume of electronic equipment is getting smaller and smaller, but the power consumption has increased. Therefore, in the design stage of electronic equipment, using heat dissipation simulation tools to simulate product heat dissipation, reduce failure rate, and improve product reliability has become the focus of electronic product design. [0003] In the prior art, the heat dissipation simulation tool adopts simulation software such as ANSYS and SolidWorks, which can simulate the heat radiation, heat conduction, heat convection, fluid temperature, fluid velocity and motion vector of the printed circuit board in the three-dimensional structure model, and can also simulate...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2806G01R31/2817
Inventor 马志明
Owner CRRC DALIAN R & D CO LTD