Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Method for optimizing thermal cycle and random vibration life of LCCC chip solder joint of car networking

A technology of random vibration and optimization methods, applied in design optimization/simulation, computer-aided design, special data processing applications, etc. The effect of cycle life

Active Publication Date: 2019-01-11
GUILIN UNIV OF ELECTRONIC TECH
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the above three documents, the welding process of LCCC solder joints has been studied, but the existing research results reflect that scholars at home and abroad are only limited to unilateral thermal cycle or unilateral vibration analysis of solder joints, and have not considered solder joints. Thermal cycle and vibration analysis. Under actual application conditions, solder joints must have thermal cycle and vibration reliability at the same time. Therefore, it is necessary to conduct research on the combination of thermal cycle and vibration reliability analysis of solder joints to ensure that solder joints with higher reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for optimizing thermal cycle and random vibration life of LCCC chip solder joint of car networking
  • Method for optimizing thermal cycle and random vibration life of LCCC chip solder joint of car networking
  • Method for optimizing thermal cycle and random vibration life of LCCC chip solder joint of car networking

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0065] Such as figure 1 As shown, 1) establish the finite element analysis model of LCCC solder joint;

[0066] 2) Obtain the thermal cycle stress of the LCCC solder joints: apply constraints to the model built in step 1), perform analysis under temperature cycle loading conditions, and then use ANSYS software to simulate and analyze the model to obtain the stress distribution of the LCCC solder joints;

[0067] 3) Obtain the random vibration stress of the LCCC solder joint: impose constraints on the model built in step 1), perform analysis under random vibration loading conditions, and then use ANSYS software to simulate and analyze the model to obtain the stress distribution of the LCCC solder joint;

[0068] 4) Determine the influencing factors that affect the thermal cycle and random vibration of LCCC solder joints: specifically include LCCC pad width W, pad length L, gap height H, and stencil thickness T, so as to obtain a set of process parameters that can be optimized a...

test approach Y1

[0079] Test plan Y 1 :X 1 ={X 11 ,X 12 ,X 13 , X 14}={M 1 , N 1} (3)

test approach Y2

[0080] Test plan Y 2 :X 2 ={X 21 ,X 22 ,X 23 , X 24}={M 2 , N 2} (4)

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Lengthaaaaaaaaaa
Gap heightaaaaaaaaaa
Login to View More

Abstract

A method for optimizing the thermal cycle and random vibration life of an LCCC chip solder joint of car networking is provided. The thermal fatigue life and random vibration life of LCCC solder jointsare calculated by establishing the finite element simulation model of LCCC solder joints and performing solder joint thermal cyclic loading and random vibration loading stress-strain finite element analysis simulation analysis. The method further comprises the steps of selecting the pad width, pad length, clearance height and steel net thickness as design variables, in order to maximize the thermal fatigue life and random vibration life of solder joints, carrying out the multi-objective reliability optimization design of LCCC solder joints by means of orthogonal test and grey relational analysis, and finally designing the parameter combinations making both the thermal cycle life and random vibration life of solder joints optimal. The method is simple and facilitates the later parameter optimization design and the optimized calculation results are ideal, and the method provides scientific guidance for the LCCC solder joint structure parameter design.

Description

technical field [0001] The invention relates to the technical field of microelectronic package reliability of the Internet of Vehicles, in particular to optimization of thermal cycle and random vibration life of the leadless ceramic chip carrier (Leadless Ceramic Chip Carrier, LCCC) chip solder joint of the Internet of Vehicles based on orthogonal design and gray correlation method. Background technique [0002] The Internet of Vehicles (Internet of Vehicles) is a huge interactive network composed of information such as vehicle location, speed and route. Through GPS, RFID, sensors, camera image processing and other devices, vehicles can complete the collection of their own environment and state information; through Internet technology, all vehicles can transmit and gather their own various information to the central processing unit; through computer technology, these Information from a large number of vehicles can be analyzed and processed to calculate optimal routes for di...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
CPCG06F2119/06G06F30/23
Inventor 李春海赵峰李晓欢
Owner GUILIN UNIV OF ELECTRONIC TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com