A electron beam cladding process parameter optimization method and system based on a temperature field
A technology of process parameter optimization and electron beam cladding, applied in the field of electron beam cladding, can solve the problems of short action time, huge workload, high cost, etc., and achieve the effect of reducing test cost, reducing workload and avoiding waste.
Active Publication Date: 2019-01-11
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology
[0003]Because the electron beam cladding process is carried out under vacuum conditions, and the temperature generated by the electron beam when heating the sample is very high, and the action time is also extremely short. Therefore, it is very difficult to directly measure the temperature of electron beam cladding by traditional experimental methods, and it will generate huge workload and high cost
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specific Embodiment 1
[0084] Step 1: Select Inconel617 as the substrate: the specification is 40mm×20mm×9mm, which has good mechanical properties under high temperature conditions, especially good corrosion resistance under the carbonization and oxidation environment cycled at 1373K high temperature. Silicide has high temperature corrosion resistance, so it is selected as the material coated on the surface of the nickel-based alloy, and the specification is 40mm×20mm×1mm.
[0085] Analysis of substrate and cladding materials: the thermophysical properties of Inconel617 and silicide are shown in Table 1 and Table 2
[0086] Table 1: Inconel617 thermal physical properties
[0087]
[0088] Table 2 Silicide thermophysical properties
[0089]
[0090] Step 2: Establish a finite element model in the software ANSYS according to the structural size of the sample. In order to accurately reflect the change of the temperature field of the preset layer, a fine grid should be used. The heat-affected zo...
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The invention discloses an electron beam cladding process parameter optimization method and system based on a temperature field. The method comprises the following steps of: obtaining cladding conditions and structural dimensions, wherein the cladding conditions include ambient temperature, cladding process, cladding layer material and substrate material, and the structural dimensions include cladding layer size and substrate size; establishing a finite element analysis model according to the cladding condition and the structure size; meshing the finite element analysis model to obtain a cladding mathematical model; varrying out moving loading on the mathematical model of the cladding to obtain the distribution of the cladding temperature field; snalyzing the distribution of the cladding temperature field to obtain an optimal processing parameter; adopting a univariate test for the optimal processing parameters to obtain the optimal parameters. The method or the system of the inventioncan avoid the waste of a large number of test workpieces, reduce the workload of the cladding parameter optimization and reduce the test cost.
Description
technical field [0001] The invention relates to the field of electron beam cladding, in particular to an electron beam cladding process parameter optimization method and system based on a temperature field. Background technique [0002] The electron beam cladding technology relies on the heat source of the electron beam to melt the cladding material to produce a unique cladding layer on the surface of the sample, thereby improving various performance indicators of the sample surface. Cladding using a high-energy electron beam allows for precise control of heat input and allows for easy cladding of different specimens independent of the surface properties of the material. [0003] Because the electron beam cladding process is carried out under vacuum conditions, and the temperature generated by the electron beam when heating the sample is very high, and the action time is also extremely short, so if you want to rely on the traditional experimental method to directly measure t...
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IPC IPC(8): G06F17/50
CPCG06F30/23
Inventor 刘海浪祁正伟黄以平张国培王波王小宇
Owner GUILIN UNIV OF ELECTRONIC TECH