A manufacturing method of a Z-direction interconnected PCB and the PCB

Abstract

The invention relates to the technical field of PCB, and discloses a manufacturing method of a Z-direction interconnected PCB and the PCB, which comprises the following steps of: manufacturing a firstdaughter board and a second daughter board, so that the copper thickness of the laminating surfaces of the first daughter board and the second daughter board is increased to a preset value; the two sides of the intermediate plate are respectively pasted with film, and the through holes are opened and filled with conductive medium to form a connecting plate. The positions of the through holes correspond to the first pad of the first daughter board and the second pad of the second daughter board. The first daughter board, the connection board and the second daughter board are laminated and laminated, and the first pad is electrically connected with the second pad through a conductive medium to form a Z-interconnected PCB. The embodiment of the invention only adjusts the copper thickness ofthe pressing surfaces of the two daughter boards and realizes the electric connection of the two daughter boards by pressing, For the connecting board between the two daughter boards, there is no needto carry out many operations such as electroplating, resin plug hole and resin grinding, which not only greatly simplifies the manufacturing process and reduces the manufacturing cost, but also effectively ensures the good conduction of the two daughter boards and improves the yield of the product.

Description

technical field [0001] The present invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a Z-direction interconnected PCB and the PCB. Background technique [0002] Under the general trend of high-frequency and high-speed communication, the client requires the capacity of the PCB board to be larger and larger, so that the wiring density of the PCB board is getting higher and higher, the number of design layers is getting higher and higher, and the aperture is getting smaller and smaller. [0003] However, the current PCB processing capacity cannot meet the drilling and electroplating production requirements of ultra-high thickness-to-diameter ratio PCBs. Therefore, N+M, N+N and other designs are more and more applied, but how to realize N+M, N+ The Z-direction partial interconnection between Ns has always been a difficult problem in the industry. [0004] At present, the commonly used meth...

AI Technical Summary

Problems solved by technology

[0012] The object of the present invention is to provide a method for manufacturing a Z-direction interconnected PCB and a PCB to overcome the defects of complex manufacturing process, high cost and low product yield in the prior art

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