A chip heat sink, a preparation method thereof, and a DBC substrate assembly

A radiator and chip technology, which is applied in the manufacturing of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of high cost, inability to guarantee the uniformity of fillers, and high implementation difficulty.

Active Publication Date: 2019-01-15
BYD CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The heat sink of this prior art is formed by filling metal materials between ceramic sheets through high-temperature sintering. Ensure the uniformity of the filler (filler area thickness, etc.), which may cause problems with the airtightness between the laminated ceramics; metal paste needs to be filled between the ceramic plates, and the cost will be relatively high
In addition, the thermal conductivity of the ceramic body is p

Method used

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  • A chip heat sink, a preparation method thereof, and a DBC substrate assembly
  • A chip heat sink, a preparation method thereof, and a DBC substrate assembly
  • A chip heat sink, a preparation method thereof, and a DBC substrate assembly

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Embodiment Construction

[0057] Neither the endpoints nor any values ​​of the ranges disclosed herein are limited to such precise ranges or values, and these ranges or values ​​are understood to include values ​​approaching these ranges or values. For numerical ranges, between the endpoints of each range, between the endpoints of each range and individual point values, and between individual point values ​​can be combined with each other to obtain one or more new numerical ranges, these values Ranges should be considered as specifically disclosed herein.

[0058] One aspect of the present invention provides a chip radiator, such as figure 1 and 2 As shown, the chip heat sink includes: an upper end cover 1, a co-fired laminated heat dissipation structure 2 and a lower end cover 3 which are sequentially laminated. The lower end cover 3 is provided with a cooling liquid inlet 31 and a cooling liquid outlet 32. The material of the co-fired laminated heat dissipation structure 2 is oxygen-free copper, an...

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Abstract

The invention relates to the field of chip heat sink, in particular to a chip heat sink, a preparation method thereof and a DBC substrate assembly. The chip heat sink comprises an upper end cover, a co-fired laminated heat dissipation structure and a lower end cover, wherein the lower end cover is provided with a coolant inlet and a coolant outlet; the material of the co-fired laminated heat dissipation structure is oxygen-free copper; and the material of the upper end cover and the lower end cover is oxygen-free copper and/or copper-containing alloy. Also disclosed are a method for manufacturing a chip heat sink and a DBC substrate assembly including the chip heat sink of any structure described above. The chip heat sink of the invention has good cold and heat shock resistance, heat conductivity and seal property of the chip heat sink, the cost of the chip heat sink of the invention is low, and the preparation process is easy to operate and realize.

Description

technical field [0001] The invention relates to the field of chip radiators, in particular to a chip radiator, a preparation method thereof, and a DBC substrate assembly. Background technique [0002] Patent application CN103295982A discloses a copper-clad ceramic heat sink for electronic packaging modules. Its co-fired laminated ceramic heat dissipation structure sinters multiple single-layer ceramic sheets into a single sintered body through metal materials. The single-layer ceramic sheets constituting the co-fired laminated ceramic structure are punched with through holes forming heat dissipation water channels, and the multi-layer monolithic ceramics are laminated to form a staggered structure, forming water channels in the co-fired laminated ceramic structure. The high-temperature co-fired laminated ceramic structure has two single-layer ceramics without a through-hole structure, and is located on the upper and lower surfaces of the co-fired laminated ceramic structure ...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L23/373H01L21/48
CPCH01L21/4803H01L23/3735H01L23/473
Inventor 徐强张天龙温怀通林信平
Owner BYD CO LTD
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