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Fan-out type antenna packaging structure and packaging method

A technology of antenna structure and packaging method, which is applied in the direction of antenna support/mounting device, antenna, antenna parts, etc., can solve the problems of large volume occupied by antenna packaging structure and poor integration, achieve high-efficiency antenna performance, and improve production efficiency , highly integrated effect

Pending Publication Date: 2019-01-18
SJ SEMICON JIANGYIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, it is necessary to design a new fan-out antenna packaging structure and packaging method to solve the above technical problems caused by the antenna packaging structure occupying a large volume and poor integration

Method used

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  • Fan-out type antenna packaging structure and packaging method
  • Fan-out type antenna packaging structure and packaging method
  • Fan-out type antenna packaging structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] like figure 1 , this embodiment provides a fan-out antenna packaging method, including the following steps:

[0065] providing a support base on which a separation layer is formed;

[0066] forming a rewiring layer on the separation layer, the rewiring layer including a first surface in contact with the separation layer and an opposite second surface;

[0067] At least two antenna structures stacked on the second surface of the rewiring layer are formed, the antenna structure is electrically connected to the metal wiring layer in the rewiring layer, and the rewiring layer protrudes from the antenna The side of the structure; the projected areas of the adjacent antenna structures in the horizontal direction are not equal, and the projection of the antenna structure in the horizontal direction covers the metal wiring layer;

[0068] exposing a first side of the redistribution layer based on the separation layer;

[0069] A semiconductor chip is provided, the semiconducto...

Embodiment 2

[0097] For further making those skilled in the art understand advantage and effect of the present invention, as Figure 17 ~ Figure 23 , which shows a structural schematic view of each step of another fan-out antenna packaging method in the present invention. The main difference between the present embodiment and the first embodiment lies in that the antenna structures of different structures are formed. Wherein, the antenna structure is stacked in a stepped manner from the second surface of the rewiring layer 103 upwards, so as to flexibly control the volume of the fan-out antenna package structure and expand the application range of the fan-out antenna package structure.

[0098] Specifically, the specific material, forming method, and shape of the antenna structure can refer to Embodiment 1, which will not be repeated here. Such as Figure 17 , when preparing the second encapsulation layer 135 in the second antenna structure 105, according to the process requirements, the...

Embodiment 3

[0101] Such as Figure 24 , this embodiment illustrates a schematic structural diagram of a fan-out antenna package structure in the present invention, and the package structure includes:

[0102] A rewiring layer 103, the rewiring layer 103 includes opposite first and second surfaces;

[0103] At least two layers of antenna structures stacked, the antenna structure is located on the second surface of the rewiring layer 103, and is electrically connected to the metal wiring layer 123 in the rewiring layer 103, and the side of the antenna structure has the same plane, and the projection of the antenna structure in the horizontal direction covers the metal wiring layer 123;

[0104] The semiconductor chip 107 and the metal bump 108 are located on the first surface of the rewiring layer 103 and are electrically connected to the metal wiring layer 123, and the projection of the antenna structure in the horizontal direction covers the semiconductor chip 107 and metal bumps 108 . ...

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Abstract

The invention provides a fan-out type antenna packaging structure and a packaging method. In the fan-out type antenna packaging method, at least two layers of antenna structures stacked and arranged are formed on the second surface of a rewiring layer. The antenna structure is electrically connected with a metal wiring layer in the rewiring layer, and the rewiring layer protrudes from the side surface of the antenna structure. The projection area of the connected antenna structure is different in the horizontal direction, and the projection of the antenna structure in the horizontal directioncovers the metal wiring layer. The semiconductor chip and the metal bump are bonded to the first surface of the rewiring layer and electrically connected to the metal wiring layer, and the projectionof the antenna structure in the horizontal direction covers the semiconductor chip and the metal bump. So as to form a stacked fan-out antenna packaging structure with multi-layer antenna structure, high efficiency antenna performance and high integration, the fan-out type antenna packaging structure can save cost, improve production efficiency, flexibly control the volume of the fan-out antenna packaging structure, and enlarge the application range of the fan-out antenna packaging structure.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and relates to a fan-out antenna packaging structure and a packaging method. Background technique [0002] Lower cost, more reliable, faster and higher density circuits are the goals pursued by integrated circuit packaging. In the future, integrated circuit packaging will increase the integration density of various electronic components by continuously reducing the feature size. Currently, commonly used packaging methods include: Wafer Level Chip Scale Packaging (WLCSP), Fan-Out Wafer Level Package (FOWLP), Flip Chip, Package on Package (Package on Package, POP) and so on. Among them, FOWLP has become one of the more commonly used packaging methods because of its large number of input / output ports (I / O) and better integration flexibility. [0003] With the popularization of high-tech electronic products and the increase of people's demand, especially in order to meet the needs ...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56H01L23/498H01Q1/22
CPCH01L23/49816H01Q1/2283H01L21/561H01L23/3128H01L2924/15321H01L2224/73204H01L2224/16227H01L2223/6677
Inventor 吕娇陈彦亨林正忠
Owner SJ SEMICON JIANGYIN CORP
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