A DO-13 type transient voltage suppression diode
A transient voltage suppression, DO-13 technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of unbearable constant acceleration test assessment, unreasonable inner lead structure design, difficult production and assembly, etc., to achieve improved The effect of anti-constant acceleration test ability, reducing assembly difficulty and improving reliability
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[0014] The technical solution of the present invention is further described below, but the scope of protection is not limited to the description.
[0015] A DO-13 type transient voltage suppression diode, including a die A2 and a die B4; the die A2 and the die B4 are connected through a thin copper sheet 3, the center of the die A2 is connected with an inner lead 1, and the die The other end of B4 is connected to the thick copper sheet 5, and the other end of the thick copper sheet 5 is connected to the tube base 6, and the center of the tube base 6 is provided with a lead wire to connect with the thick copper sheet 5.
[0016] The die A2 is a low-doped diode die.
[0017] The die B4 is a transient voltage diode die.
[0018] The thickness of described thin copper sheet 3 is 0. thick copper sheet 5mm.
[0019] The thickness of the thick copper sheet 5 is 1mm for the inner lead.
[0020] Both end surfaces of the thin copper sheet 3 and the thick copper sheet 5 are planes.
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