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Photoresist stripping apparatus and stripping method thereof

A technology for stripping equipment and photoresist, which is applied in the field of photoresist stripping equipment and photoresist stripping, can solve the problems of silicon source loss and other problems, achieve the effects of reducing silicon loss, reducing residues and volatiles, and prolonging waiting time

Active Publication Date: 2019-01-22
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Residues and volatiles react with silicon on the wafer surface at relatively high temperatures, causing more silicon source loss

Method used

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  • Photoresist stripping apparatus and stripping method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] The first embodiment of the photoresist stripping equipment provided by the present invention includes: a photoresist vacuum stripping chamber, a first transfer module, a second transfer module and a wafer box;

[0033] The wafer without photoresist stripping is sent from the wafer cassette to the first transfer module, and then sent into the photoresist vacuum stripping chamber by the first transfer module, and the photoresist stripping is carried out on the wafer in the photoresist vacuum stripping chamber, and the photoresist is peeled off. The wafers are transported by the second transfer module to the first transfer module and then transferred to the wafer box for storage;

[0034] Wherein, the first transmission module can balance the second transmission module and the external air pressure, the second transmission module is a non-vacuum environment, the internal pressure of the second transmission module has a pressure difference from the external air pressure, an...

no. 2 example

[0035] The second embodiment of the photoresist stripping equipment provided by the present invention, the second embodiment of the photoresist stripping equipment provided by the present invention, includes: a photoresist vacuum stripping chamber, a first transfer module, a second transfer module and a wafer cassette;

[0036] The wafer without photoresist stripping is sent from the wafer cassette to the first transfer module, and then sent into the photoresist vacuum stripping chamber by the first transfer module, and the photoresist stripping is carried out on the wafer in the photoresist vacuum stripping chamber, and the photoresist is peeled off. The wafers are transported by the second transfer module to the first transfer module and then transferred to the wafer box for storage;

[0037] Wherein, the first transmission module can balance the second transmission module and the external air pressure, the second transmission module is a non-vacuum environment, the internal ...

no. 3 example

[0038] The third embodiment of the photoresist stripping equipment provided by the present invention includes: a photoresist vacuum stripping chamber, a first transfer module, a second transfer module and a wafer box;

[0039] The wafer without photoresist stripping is sent from the wafer cassette to the first transfer module, and then sent into the photoresist vacuum stripping chamber by the first transfer module, and the photoresist stripping is carried out on the wafer in the photoresist vacuum stripping chamber, and the photoresist is peeled off. The wafers are transported by the second transfer module to the first transfer module and then transferred to the wafer box for storage;

[0040]Wherein, the first transmission module can balance the second transmission module and the external air pressure, the second transmission module is a non-vacuum environment, the internal pressure of the second transmission module has a pressure difference from the external air pressure, and...

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Abstract

The invention discloses a photoresist stripping apparatus. A wafer including unstripped photoresist is fed from the wafer box into the first transfer module, and the wafer is fed into the photoresistvacuum stripping cavity by the first transfer module, the wafer is stripped in the photoresist vacuum stripping cavity, and the wafer stripped from the photoresist is transported by the second transfer module to the first transfer module and then transferred to the wafer box for storage.The first transfer module is capable of balancing the second transfer module with the external air pressure, thesecond transfer module is a non-vacuum environment, and the second transfer module has a pressure difference between the internal pressure of the second transfer module and the external air pressure,and the second transfer module is capable of sucking the protective gas into the protective gas to clean the residue and volatile matter on the surface of the wafer by using the pressure difference.The invention also discloses a photoresist stripping method. The invention can effectively reduce the residues and volatiles on the surface of the wafer, reduce the silicon loss in the active region,and prolong the waiting time of the subsequent wet process.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a photoresist stripping device. The invention also relates to a photoresist stripping method. Background technique [0002] The photoresist stripping process is an important process in the semiconductor manufacturing process. The photoresist stripping effect and cleaning degree directly affect the quality of the subsequent process of the semiconductor device. [0003] In the existing photoresist stripping process, the ion-implanted photoresist is stripped and the wafer is sent into the wafer box through the transfer module. Such as figure 1 Shown, a kind of production process of existing photoresist stripping equipment, the wafer of unstripped photoresist is sent out from wafer box (wafer box pressure is standard atmospheric pressure) and enters the first conveying module, and the first conveying module has pressure balance function. The photoresist vacuum stripping chamber and e...

Claims

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Application Information

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IPC IPC(8): G03F7/42
CPCG03F7/42
Inventor 孟祥国李全波陆连
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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