Anti-splashing laser soldering paste and preparation method thereof

A laser welding and anti-spatter technology, used in welding equipment, welding media, manufacturing tools, etc., can solve problems such as poor wettability, spatter, tin beads, etc., achieve high adhesion, reduce substrate oxidation, and reduce tin The effect of beads

Active Publication Date: 2020-08-25
深圳市唯特偶新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention also belongs to SMT solder paste, and when it is applied to laser solder paste welding, there are also problems such as fried tin, spatter, tin beads, and poor wettability.

Method used

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  • Anti-splashing laser soldering paste and preparation method thereof
  • Anti-splashing laser soldering paste and preparation method thereof
  • Anti-splashing laser soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The anti-splash laser solder paste is composed of the following raw materials in weight percentage: alloy powder 88.7%, flux 11.3%;

[0035] Among them, the alloy powder is Sn96.5Ag3.0Cu0.5 with a melting point of 138°C prepared according to the United States Joint Industry Standard J-STD-005;

[0036] The flux is composed of the following components: KR-610 rosin 31.5g, KE-604 rosin 13.5g, polyamide 3g, hydrogenated castor oil 6g, suberic acid 3g, malic acid 4g, 3-propanolamine 5g, high boiling point additive 4g, 1.5g of compound X, 24.5g of diethylene glycol monooctyl ether, and 4g of glycerol.

[0037] Wherein, the high boiling point additive is composed of the following components in weight percentage: 25% of ethylene glycol diacetate, 25% of dimethylacetamide, and 50% of 2-phenoxyethanol.

[0038] The preparation steps of compound X are:

[0039] Add 1,3-dichloropropane, ethylimidazole, and toluene with a ratio of 0.5mol:1mol:250mL into the reaction flask, conden...

Embodiment 2

[0046] The anti-splash laser solder paste is composed of the following raw materials in weight percentage: alloy powder 89.5%, flux 10.5%;

[0047] Among them, the alloy powder is Sn42Bi58 prepared according to the United States Joint Industry Standard J-STD-005 with a melting point of 217°C;

[0048] The flux is composed of the following components: KR-610 rosin 29.4g, KE-604 rosin 12.6g, polyamide wax 3g, hydrogenated castor oil 6g, glutaric acid 4g, succinic acid 2g, 3-propanolamine 5g, high boiling point Additive 4g, compound X 2g, diethylene glycol monooctyl ether 28g, glycerol 4g.

[0049] Wherein, the high boiling point additive is composed of the following components in weight percentage: 25% of ethylene glycol diacetate, 25% of dimethylacetamide, and 50% of 2-phenoxyethanol.

[0050] The preparation steps of Compound X are the same as in Example 1.

[0051] The preparation method of the present embodiment comprises the following steps:

[0052] S1. Weigh each compo...

Embodiment 3

[0057] The anti-splash laser solder paste is composed of the following raw materials in weight percentage: alloy powder 88%, flux 12%;

[0058] Among them, the alloy powder is Sn96.5Ag3.0Cu0.5 with a melting point of 138°C prepared according to the United States Joint Industry Standard J-STD-005;

[0059] The flux consists of the following components: KR-610 rosin 34.3g, KE-604 rosin 14.7g, polyamide 3g, glyceryl tris(12-acetyl ricinoleate) 5g, adipic acid 4g, glutaric acid 3g , acrylamide 5g, high boiling point additive 4g, compound X1g, diethylene glycol monooctyl ether 22g, tetraethylene glycol dibutyl ether 4g.

[0060] Wherein, the high boiling point additive is composed of the following components in weight percentage: 25% of ethylene glycol diacetate, 35% of dimethylacetamide, and 40% of 2-phenoxyethanol.

[0061] The preparation steps of Compound X are the same as in Example 1.

[0062] The preparation method of the present embodiment comprises the following steps: ...

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Abstract

The invention provides anti-splashing laser soldering paste. The anti-splashing laser soldering paste is prepared from raw materials in percent by weight: 87%-90% of alloy powder and 10%-13% of scaling powder. The alloy powder is formed by mixing one or more kinds of tin-based alloy powder and has a eutectic composition. The scaling powder is prepared from components in percent by weight: 35%-55%of rosin, 4%-9% of a thixotropic agent, 3%-9% of organic acid, 2%-8% of organic amine, 2%-6% of a high-boiling-point additive, 1%-2% of a compound X and the balance being a solvent. The invention further provides a preparation method of the anti-splashing laser soldering paste. The anti-splashing laser soldering paste can achieve instant welding, and has good wettability, and the problems of tin blasting, splashing, tin balls, non-tin-melting and the like are avoided.

Description

technical field [0001] The invention relates to an anti-splash laser solder paste and a preparation method thereof. Background technique [0002] Laser solder paste welding is a laser welding technology that uses laser as the heat source to heat the solder paste to melt. The main feature of laser solder paste welding is to use the high energy of the laser to achieve rapid heating of local or small areas to complete the soldering process. Compared with laser solder paste welding Traditional SMT welding has irreplaceable advantages. [0003] The traditional SMT technology, that is, the surface assembly technology, mainly uses wave soldering and reflow soldering technology, and there are some fundamental problems, such as the leads of components and the pads on the printed circuit board will diffuse Cu, Fe, Various metal impurities such as Zn; molten tin material is easy to produce oxides when it flows at high speed in the air. At the same time, during traditional reflow sold...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/36B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 段佐芳赵宁吴晶
Owner 深圳市唯特偶新材料股份有限公司
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