BGA (Ball Grid Array) ball mounting method based on infrared and hot air hybrid heating technology

Abstract

The invention relates to a BGA (Ball Grid Array) ball mounting method based on an infrared and hot air hybrid heating technology, which comprises the steps of carrying out BGA device dismounting and pin arrangement, putting tin balls into a BGA fixture, setting an infrared and hot air hybrid heating reflow temperature curve, carrying out BGA solder ball reflow, mounting the tin balls on a BGA chipthrough a special fixture, and melting the tin balls by using the infrared and hot air hybrid heating system according to a preset infrared heating curve so as to complete mounting. The BGA ball mounting method uses the infrared and hot air hybrid heating technology, the heating uniformity is high, the temperature controllability is high, the ball mounting success rate is high, and the performance reduction or device body damage caused by repeated heating due to the failure of ball mounting is reduced.

Description

technical field

[0001] The invention relates to the technical field of BGA ball planting, in particular to a BGA ball planting method based on the mixed heating technology of infrared and hot air. Background technique

[0002] With the development of microelectronics technology, electronic products have entered the era of large-scale integration. Military aircraft airborne electronic products have complex functions, and the integration of boards is also higher. Large-scale integrated circuits, especially BGA packaging devices, have been widely used, and military aircraft products have attributes such as small quantities, multiple varieties, and high value. Maintenance of faulty products It is also a development need. BGA devices are usually the control part of the core of product functions, with complex functions and expensive prices. For BGA devices with good device functions but only soldering failures, re-balling can be performed on them and then reflow soldering can be ...

Examples

Embodiment Construction

[0024] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below.

[0025] Such as figure 1 The flow chart of the method is shown:

[0026] A BGA ball planting method based on infrared and hot air mixed heating technology, comprising steps:

[0027] s1) BGA device removal and pin arrangement;

[0028] s2) Put the solder ball into the BGA fixture;

[0029] s3) setting the infrared hot air mixed heating and reflow temperature curve;

[0030] s4) BGA solder ball reflow.

[0031] Further, the step s1) uses a BGA desoldering station to complete the removal of the BGA device on the faulty circuit board, and completes the BGA device pin solder cleaning operation. The cleaning process cannot cause damage to the pad, otherwise the ball planting quality will be affected.

[0032] Further, the step s2) makes a special BGA ball planting jig according to the pa...

technical field

[0001] The invention relates to the technical field of BGA ball planting, in particular to a BGA ball planting method based on the mixed heating technology of infrared and hot air. Background technique

[0002] With the development of microelectronics technology, electronic products have entered the era of large-scale integration. Military aircraft airborne electronic products have complex functions, and the integration of boards is also higher. Large-scale integrated circuits, especially BGA packaging devices, have been widely used, and military aircraft products have attributes such as small quantities, multiple varieties, and high value. Maintenance of faulty products It is also a development need. BGA devices are usually the control part of the core of product functions, with complex functions and expensive prices. For BGA devices with good device functions but only soldering failures, re-balling can be performed on them and then reflow soldering can be ...

Examples

Embodiment Construction

[0024] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below.

[0025] Such as figure 1 The flow chart of the method is shown:

[0026] A BGA ball planting method based on infrared and hot air mixed heating technology, comprising steps:

[0027] s1) BGA device removal and pin arrangement;

[0028] s2) Put the solder ball into the BGA fixture;

[0029] s3) setting the infrared hot air mixed heating and reflow temperature curve;

[0030] s4) BGA solder ball reflow.

[0031] Further, the step s1) uses a BGA desoldering station to complete the removal of the BGA device on the faulty circuit board, and completes the BGA device pin solder cleaning operation. The cleaning process cannot cause damage to the pad, otherwise the ball planting quality will be affected.

[0032] Further, the step s2) makes a special BGA ball planting jig according to the pa...

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