Integrated circuit, integrated circuit test socket with signal and power integration module

A power integrity, integrated circuit technology, applied in electronic circuit testing, components of electrical measuring instruments, measuring electricity, etc., can solve the problems of affecting test results, large energy loss, limitation, etc., and achieve the effect of stabilizing test results

Inactive Publication Date: 2019-02-01
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing integrated circuit test probe card 10 is in the post-package test process, because is limited to product structure and testing organization, usually electronic components 11, such as capacitors or memory are configured on the integrated circuit test interface board 12 (meaning Carrier printed circuit board, loadboard printcircuit board), due to the test path (eg figure 1 The ground signal test path T1 and the power signal test path T2) shown are too long, and the high-frequency test inductance effect becomes more significant, which affects the entire test result
The test information stored in the memory is also easy to cause signal distortion because the test path is too long
In addition, if the test path is too long, a large resistance will be generated, and the energy loss will be relatively large in the path through which the current flows. When the object under test 13, such as multiple integrated circuits, is tested at the same time, the current cannot be supplied in time, resulting in test failed

Method used

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  • Integrated circuit, integrated circuit test socket with signal and power integration module
  • Integrated circuit, integrated circuit test socket with signal and power integration module
  • Integrated circuit, integrated circuit test socket with signal and power integration module

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Embodiment Construction

[0035] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with reference to the attached drawings. Furthermore, the direction terms mentioned in this disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, transverse, vertical, longitudinal, axial , radial direction, the uppermost layer or the lowermost layer, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure.

[0036] Please refer to figure 2 The integrated circuit test socket 20 of the integrated signal and power integrity module of the disclosed embodiment includes a first conductive adhesive layer 21 , a second conductive adhesive layer 22 , a si...

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Abstract

The invention discloses an integrated circuit and an integrated circuit test socket with signal and power integration module, comprising a first conductive rubber layer, a second conductive rubber layer, a conductor module and a signal and power integration module. The second conductive rubber layer is opposite to the first conductive rubber layer. The conductor module comprises at least a pair ofconductors. The signal and power integration module is disposed between the first conductive rubber layer and the second conductive rubber layer. At least one pair of conductors respectively penetrate through the first and the second conductive rubber layer, an electrically contact with the signal and power integration module.

Description

technical field [0001] The disclosure relates to a test device, in particular to an integrated circuit test socket integrating signal and power integrity modules. Background technique [0002] With the advancement of electronic technology, network and other related technologies, and the gradual increase in the consumption level of the global electronic market, the demand for consumer electronic products has surged, which in turn has driven the vigorous development of the semiconductor industry. [0003] Semiconductor manufacturing (or wafer processing) includes the following steps: integrated circuit (integrated circuit, IC) design, wafer manufacturing process (wafer fabrication), wafer testing (wafer probe), wafer packaging (packaging) and packaging Post-test (final test, meaning IC test), etc., and the so-called wafer test and post-package test refer to the testing of one or more dies on a wafer that has not been singulated or a chip cut from a wafer. One or more chips (p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/28
CPCG01R1/0416G01R31/2884G01R31/2886
Inventor 李文聪
Owner CHUNGHWA PRECISION TEST TECH
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