Integrated circuit, integrated circuit test socket with signal and power integration module

Abstract

The invention discloses an integrated circuit and an integrated circuit test socket with signal and power integration module, comprising a first conductive rubber layer, a second conductive rubber layer, a conductor module and a signal and power integration module. The second conductive rubber layer is opposite to the first conductive rubber layer. The conductor module comprises at least a pair ofconductors. The signal and power integration module is disposed between the first conductive rubber layer and the second conductive rubber layer. At least one pair of conductors respectively penetrate through the first and the second conductive rubber layer, an electrically contact with the signal and power integration module.

Description

technical field [0001] The disclosure relates to a test device, in particular to an integrated circuit test socket integrating signal and power integrity modules. Background technique [0002] With the advancement of electronic technology, network and other related technologies, and the gradual increase in the consumption level of the global electronic market, the demand for consumer electronic products has surged, which in turn has driven the vigorous development of the semiconductor industry. [0003] Semiconductor manufacturing (or wafer processing) includes the following steps: integrated circuit (integrated circuit, IC) design, wafer manufacturing process (wafer fabrication), wafer testing (wafer probe), wafer packaging (packaging) and packaging Post-test (final test, meaning IC test), etc., and the so-called wafer test and post-package test refer to the testing of one or more dies on a wafer that has not been singulated or a chip cut from a wafer. One or more chips (p...

AI Technical Summary

Problems solved by technology

Existing integrated circuit test probe card 10 is in the post-package test process, because is limited to product structure and testing organization, usually electronic components 11, such as capacitors or memory are configured on the integrated circuit test interface board 12 (meaning Carrier printed circuit board, loadboard printcircuit board), due to the test path (eg figure 1 The ground signal test path T1 and the power signal test path T2) shown are too long, and the high-frequency test inductance effect becomes more significant, which affects the entire test result

The test information stored in the memory is also easy to cause signal distortion because the test path is too long

In addition, if the test path is too long, a large resistance will be generated, and the energy loss will be relatively large in the path through which the current flows. When the object under test 13, such as multiple integrated circuits, is tested at the same time, the current cannot be supplied in time, resulting in test failed

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