Passive equalizer for differential through-silicon via transmission channels and design method thereof
A technology of passive equalizer and transmission channel, which is applied in the direction of multi-terminal pair network, impedance network, electrical components, etc. It can solve the problems of interface energy loss, limit system bandwidth, etc., and achieve the effect of improving transmission quality
Active Publication Date: 2019-02-05
HANGZHOU DIANZI UNIV
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Problems solved by technology
Active equalizer is the most common and traditional method to solve the problem of intersymbol interference, but its negative effects such as limiting system bandwidth and excessive interface energy loss affect its function.
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[0046] The present invention will be further described below in conjunction with accompanying drawing.
[0047] figure 1It is a schematic cross-sectional view of a vertical section of a conventional TSV, which is located in a silicon substrate 109 and includes a first inner metal core 101 and a first outer oxide layer 102 . The first metal core 101 is made of copper or tungsten. The first outer insulating layer 102 is generally made of silicon dioxide material to prevent leakage current. If copper is used, in order to prevent the diffusion of copper atoms, a layer of isolation will be added between the first metal inner core 101 and the first outer insulating layer 102. layer.
[0048] Figure 2A and Figure 2B It is a structural diagram of a passive equalizer for a differential TSV transmission channel according to the present invention, including a first passive equalizer 301 and a second passive equalizer 401 with identical structures. The first passive equalizer 301 i...
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The invention discloses a passive equalizer for differential through-silicon via transmission channels and a design method thereof. According to an active equalizer, system bandwidth is limited, so interface energy loss is high. According to the passive equalizer, a first passive equalizer comprises a first metal wire, and a first connection wire and a second connection wire which are connected with two ends of the first metal wire; a second passive equalizer comprises a second metal wire, and a third connection wire and a fourth connection wire which are connected with two ends of the secondmetal wire; and the first metal wire and the second metal wire are spiral wires in a plane. According to the design method provided by the invention, electrical parameters comprising target resistanceand target inductance of the first metal wire and the second metal wire are computed through utilization manufacturing process information; and structure parameters are solved through utilization ofa group of closed mathematical expressions and a multitarget optimization function. According to the passive equalizer and the design method, the intersymbol interference problem existing in a digitaldifferential signal transmission system is effectively solved, a transmission band is smooth, transmission quality of high speed digital signals is effectively improved, and the design method is highin efficiency.
Description
technical field [0001] The invention belongs to the technical field of passive electronic devices, and relates to a passive equalizer for differential through-silicon hole transmission channels in three-dimensional integrated circuits and a design method thereof. Background technique [0002] Differential transmission mode has become an important technology of high-speed digital signal transmission system. Differential transmission has a high effective suppression ability to external interference, which can effectively improve the transmission quality of signals. In three-dimensional integrated circuits, the differential transmission structure for through-silicon via technology can effectively improve system integration, reduce energy loss, and improve system stability. In this regard, the researchers proposed a Ground-Signal-Signal-Ground (G-S-S-G) structure of differential through-silicon vias and on-chip interconnect transmission structures to improve the transmission qu...
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Login to View More IPC IPC(8): H03H7/06
CPCH03H7/06
Inventor 赵文生傅楷王晶胡月王高峰
Owner HANGZHOU DIANZI UNIV