Passive equalizer for differential TSV transmission channel and its design method
A technology of passive equalizer and transmission channel, which is applied in the direction of multi-terminal pair network, electrical components, impedance network, etc. It can solve the problems of limiting system bandwidth and the impact of interface energy loss, achieving the effect of flat frequency band and improving transmission quality
Active Publication Date: 2022-04-01
HANGZHOU DIANZI UNIV
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Problems solved by technology
Active equalizer is the most common and traditional method to solve the problem of intersymbol interference, but its negative effects such as limiting system bandwidth and excessive interface energy loss affect its function.
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[0046] The present invention will be further described below in conjunction with accompanying drawing.
[0047] figure 1It is a schematic cross-sectional view of a vertical section of a conventional TSV, which is located in a silicon substrate 109 and includes a first inner metal core 101 and a first outer oxide layer 102 . The first metal core 101 is made of copper or tungsten. The first outer insulating layer 102 is generally made of silicon dioxide material to prevent leakage current. If copper is used, in order to prevent the diffusion of copper atoms, a layer of isolation will be added between the first metal inner core 101 and the first outer insulating layer 102. layer.
[0048] Figure 2A and Figure 2B It is a structural diagram of a passive equalizer for a differential TSV transmission channel according to the present invention, including a first passive equalizer 301 and a second passive equalizer 401 with identical structures. The first passive equalizer 301 i...
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The invention discloses a passive equalizer for differential through-silicon hole transmission channels and a design method thereof. The active equalizer limits the system bandwidth, and the interface consumes a lot of energy. The first passive equalizer of the passive equalizer of the present invention includes a first metal wire and a first connection wire and a second connection wire connected to both ends of the first metal wire; the second passive equalizer includes a second metal wire and a connection The third connection line and the fourth connection line at the two ends of the second metal line; the first metal line and the second metal line are both spiral lines on a plane. The design method of the invention first calculates the electrical parameters of the first metal wire and the second metal wire by using the manufacturing process information, including target resistance and target inductance, and then uses a set of closed mathematical expressions and multi-objective optimization functions to obtain the structural parameters. The invention effectively solves the intersymbol crosstalk problem existing in the digital differential signal transmission system, makes the transmission frequency band flat, effectively improves the transmission quality of the high-speed digital signal, and has high design method efficiency.
Description
technical field [0001] The invention belongs to the technical field of passive electronic devices, and relates to a passive equalizer for differential through-silicon hole transmission channels in three-dimensional integrated circuits and a design method thereof. Background technique [0002] Differential transmission mode has become an important technology of high-speed digital signal transmission system. Differential transmission has a high effective suppression ability to external interference, which can effectively improve the transmission quality of signals. In three-dimensional integrated circuits, the differential transmission structure for through-silicon via technology can effectively improve system integration, reduce energy loss, and improve system stability. In this regard, the researchers proposed a Ground-Signal-Signal-Ground (G-S-S-G) structure of differential through-silicon vias and on-chip interconnect transmission structures to improve the transmission qu...
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IPC IPC(8): H03H7/06
CPCH03H7/06
Inventor 赵文生傅楷王晶胡月王高峰
Owner HANGZHOU DIANZI UNIV