Low-density material perspective imaging method and system

A low-density material and imaging method technology, which is applied in the field of low-density material perspective imaging method and system, and can solve problems such as impact, wire evaluation, and excess
CN109324068BActive Publication Date: 2022-07-22SHENZHEN STS MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN STS MICROELECTRONICS CO LTD
Publication Date
2022-07-22

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Abstract

The invention discloses a low-density material perspective imaging method and system, which are used for imaging a viewing device in a package by ultrasonic waves. The viewing device includes a first element with a first surface, a second element with a second surface, and a connecting A wire on a surface and a second surface; the first surface and the second surface are located on different planes, and the wire is a wire with a density of less than 5 grams per cubic centimeter; the method includes: acquiring a first focusing parameter of the first surface, and acquiring a first The second focusing parameters of the two surfaces; the inspection device is scanned and imaged according to the scanning constraints, and the scanning constraints are specifically generated according to the first focusing parameters and the second focusing parameters. It can not only obtain good imaging effects on the first surface and the second surface, but also better reflect the low-density wires in the imaging results; realize the scanning of components with low-density wires under non-destructive conditions imaging.
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Description

technical field

[0001] The invention relates to the field of component detection, in particular to a low-density material perspective imaging method and system. Background technique

[0002] Under the current laboratory conditions, the conventional X-RAY fluoroscopic imaging technology sometimes cannot image the wires in the components. For example, X-RAY fluoroscopic imaging cannot be used for low-density metal wires in some components. like figure 1 and figure 2 They are the results of X-ray imaging of the two components respectively, and it can be seen that the wires in them are not reflected.

[0003] Therefore, in the prior art, it is difficult to perform necessary evaluation on the wires of such components under non-destructive conditions, and it is impossible to characterize defects such as missing, deformed, excessive and abnormal welding positions of metal wires; it will lead to failure analysis. The chain of evidence is incomplete, which affects the qualitative...

Claims

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