Low-density material perspective imaging method and system

A low-density material and imaging method technology, which is applied in the field of low-density material perspective imaging method and system, and can solve problems such as impact, wire evaluation, and excess

Active Publication Date: 2022-07-22
SHENZHEN STS MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Therefore, the existing technology is difficult to carry out the necessary evaluation of the wires of this type of components under non-destructive conditions, and it is impossible to characterize defects such as missing, deformed, excess, and abnormal welding positions of the metal wires; it will lead to failure analysis. The evidence chain is incomplete, which affects the qualitative accuracy of product failure, thereby affecting the quality evaluation of components

Method used

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  • Low-density material perspective imaging method and system
  • Low-density material perspective imaging method and system
  • Low-density material perspective imaging method and system

Examples

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Embodiment 1

[0071] like image 3 It is a schematic flow chart of a low-density material fluoroscopic imaging method.

[0072] Exemplarily, low-density material fluoroscopic imaging methods can be used to Figure 4 , Figure 5 The inspection device 120 within the package 110 of the illustrated component 100 is imaged.

[0073] The viewing device 120 includes a first element 121 having a first surface 101 , a second element 122 having a second surface 102 , and wires 123 connecting the first surface 101 and the second surface 102 .

[0074] like Figure 4 and Figure 5 As shown, the first surface 101 and the second surface 102 are located in different planes. In practical situations, the wires 123 inside the component 100 , especially the two ends of the wires 123 are usually not on the same plane, and there is a certain height difference. Exemplary as Figure 4 and Figure 5 As shown, the first element 121 is the chip portion of the inspection device 120 , the second element 122 is...

Embodiment 2

[0146] like Figure 16 The shown low-density material fluoroscopic imaging method is used to image the inspection device 120 in the package body 110 of the several components 100 .

[0147] The low-density material fluoroscopic imaging method of this embodiment includes the following steps:

[0148] Step S210, arranging several components 100 in a preset manner.

[0149] Each component 100 must not have surface defects and contamination, and if there is serious contamination and highly absorbent trace contamination, such as pencil marks, etc., it needs to be cleaned.

[0150] Exemplarily, several components 100 of the same structure or model are arranged in a row, or arranged in a rectangular array, and a preset arrangement can be made according to the scanning characteristics of the ultrasonic scanning device.

[0151] Step S220: Scan and image one of the several components 100 according to the low-density material fluoroscopic imaging method according to any one of claims ...

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Abstract

The invention discloses a low-density material perspective imaging method and system, which are used for imaging a viewing device in a package by ultrasonic waves. The viewing device includes a first element with a first surface, a second element with a second surface, and a connecting A wire on a surface and a second surface; the first surface and the second surface are located on different planes, and the wire is a wire with a density of less than 5 grams per cubic centimeter; the method includes: acquiring a first focusing parameter of the first surface, and acquiring a first The second focusing parameters of the two surfaces; the inspection device is scanned and imaged according to the scanning constraints, and the scanning constraints are specifically generated according to the first focusing parameters and the second focusing parameters. It can not only obtain good imaging effects on the first surface and the second surface, but also better reflect the low-density wires in the imaging results; realize the scanning of components with low-density wires under non-destructive conditions imaging.

Description

technical field [0001] The invention relates to the field of component detection, in particular to a low-density material perspective imaging method and system. Background technique [0002] Under the current laboratory conditions, the conventional X-RAY fluoroscopic imaging technology sometimes cannot image the wires in the components. For example, X-RAY fluoroscopic imaging cannot be used for low-density metal wires in some components. like figure 1 and figure 2 They are the results of X-ray imaging of the two components respectively, and it can be seen that the wires in them are not reflected. [0003] Therefore, in the prior art, it is difficult to perform necessary evaluation on the wires of such components under non-destructive conditions, and it is impossible to characterize defects such as missing, deformed, excessive and abnormal welding positions of metal wires; it will lead to failure analysis. The chain of evidence is incomplete, which affects the qualitative...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/04
CPCG01N23/04
Inventor 刘金龙黄彩清吴凌
Owner SHENZHEN STS MICROELECTRONICS CO LTD
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