Die Packaging Method

Abstract

A method of packaging a die is provided. A substrate is provided. A redistribution layer is formed over the substrate. The die is covered by a first resin. A first portion of the first resin and a first portion of the die are removed to leave a second portion of the first resin and a second portion of the die over the substrate. The second portion of the first resin is removed. The die is covered with an encapsulant.

Description

technical field [0001] The invention relates to a chip packaging method. Background technique [0002] Please refer to Figure 1A to Figure 1E , Figure 1A to Figure 1E is a schematic diagram of a conventional die packaging method. In FIG. 1A , an adhesive layer 120 is formed on a substrate 100 , and at least one die 110 is disposed on the adhesive layer 120 . At Figure 1B In this case, a molding compound 130 is used to cover the die 110 . At Figure 1C , a portion of the molding compound 130 is removed to thin the molding compound 130 . At Figure 1D In the process, the substrate 100 is removed by removing the adhesive layer 120 to further leave the die 110 and the molding compound 130 . At Figure 1E In this method, die 110 and molding compound 130 are turned over and stacked into a multilayer structure 140, which further includes a substrate 150, an adhesive layer 160, at least one die 170, a molding compound 180, and a redistributed Layer 190 , wherein substrate...

AI Technical Summary

Problems solved by technology

like Figure 1F As shown, after removal of adhesive layer 120 and substrate 100, reapplied pressure may cause deformation of die 110 and molding compound 130

The deformation of the die 110 and the mold compound 130 may affect the integrity of the structure (such as the multi-layer structure 140 ) in the subsequent packaging process and cause a decrease in the yield of the packaging process.

In addition, after the die 110 is combined with the molding compound 130, it is difficult to adjust the thickness of the die 110.

For example, due to the material properties of the molding compound 130, it is not possible to thin the die 110 and the molding compound 130 at the same time, so the die 110 cannot be ground after being combined with the molding compound 130

Furthermore, conventional die packaging methods start at initial steps (such as Figure 1A ) has already used the die 110, which will increase the chance of the die 110 being damaged or mishandled in the subsequent packaging steps, which will lead to increased costs or reduced process yields

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