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Target cooling for physical vapor deposition (pvd) processing systems

A target and substrate processing technology, applied in electrical components, metal material coating process, vacuum evaporation coating, etc., can solve problems such as aggravating target bending/deformation

Active Publication Date: 2021-08-27
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This increased size exacerbates the target's tendency to bend / deform under heat, pressure and gravity loads

Method used

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  • Target cooling for physical vapor deposition (pvd) processing systems
  • Target cooling for physical vapor deposition (pvd) processing systems
  • Target cooling for physical vapor deposition (pvd) processing systems

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Embodiment Construction

[0014] Embodiments of the present invention provide improved cooling for target assemblies used in substrate processing systems by using cooling channels through the back plate of the target. These channels allow coolant to be provided closer to the heat source (target face), thereby facilitating more efficient heat removal from the target. More efficient removal of heat from the target results in a target with smaller thermal gradients and thus less mechanical bending / deformation.

[0015] figure 1 A simplified cross-sectional view of a physical vapor deposition (PVD) processing system 100 according to some embodiments of the invention is depicted. Examples of other PVD chambers suitable for modification in accordance with the teachings provided herein include Plus and SIP PVD processing chambers, both commercially available from Applied Materials, Santa Clara, CA. Other processing chambers from Applied Materials, Inc. or other manufacturers, including those configured ...

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Abstract

Provided herein are target assemblies for use in substrate processing systems. In some embodiments, a target assembly for use in a substrate processing system may include: a source material to be deposited on a substrate; a first backing plate configured to for supporting the source material on the front side of the first backing plate such that the front surface of the source material is opposite the substrate (when present); a second backing plate, the second backing plate coupled to the back of the first backplane; and a plurality of sets of channels disposed between the first backplane and the second backplane. These channels allow coolant to be supplied closer to the heat source (target face), thereby facilitating more efficient heat removal from the target. More efficient removal of heat from the target results in a target with smaller thermal gradients and thus less mechanical bending / deformation.

Description

[0001] This application is a divisional application of an invention patent application with an application date of August 20, 2013, an application number of 201380044702.3, and an invention title of "Target Cooling for Physical Vapor Deposition (PVD) Processing System". technical field [0002] Embodiments of the present invention generally relate to substrate processing systems, and more particularly, to physical vapor deposition (PVD) processing systems. Background technique [0003] In plasma-enhanced substrate processing systems, such as physical vapor deposition (PVD) chambers, high power density PVD sputtering with high magnetic field and high DC power can generate high energy at the sputtering target and cause the sputtering A substantial increase in the surface temperature of the target. The inventors have observed that the backside flooding of the target backplate used to cool the target may not be sufficient to capture and remove heat from the target. The inventor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35H01J37/34
CPCC23C14/3407H01J37/3408H01J37/3497
Inventor 马丁·李·莱克基思·A·米勒
Owner APPLIED MATERIALS INC
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