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Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same

A technology of resin composition and prepreg, which is applied in the field of halogen-containing antimony-free resin composition, prepreg, laminate and printed circuit board, can solve the problems of not using copper clad laminate, etc., and achieve good durability Thermal and dip soldering resistance, improved flexibility, and reduced water absorption

Active Publication Date: 2021-03-05
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The epoxy resin composition of the invention can not only meet the UL-94V-0 flame retardant standard, it is a halogen-free and antimony-free resin composition, but it is suitable for semiconductor devices and integrated circuits, and has not been applied to copper clad foil laminate

Method used

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  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same
  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same
  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0057] Examples 1-6 and Comparative Examples 1-13

[0058] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-6 and Comparative Examples 1-13 are shown in Table 1 and Table 2.

Embodiment 1～8

[0059] The specific components and component content of the resin composition of table 1 embodiment 1~8

[0060]

[0061]

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PUM

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Abstract

The invention provides a halogen-containing antimony-free resin composition, a prepreg, a laminate and a printed circuit board using the same. The halogen-containing antimony-free resin composition includes the following components in parts by weight: 20 to 50 parts Phosphorus-containing epoxy resin, 20-50 parts of non-flame-retardant epoxy resin, 20-60 parts of composite curing agent, 0.05-1.0 parts of curing accelerator and 10-50 parts of composite filler; the composite filler is A combination of phosphorus-based flame-retardant materials and nitrogen-based flame-retardant materials, the composite curing agent is a composite curing agent containing halogen. The present invention uses composite fillers and composite curing agents to make the resin composition system achieve the effect of phosphorus-bromine-nitrogen synergistic flame retardancy, which meets the restriction requirements of international environmental regulations on antimony compounds, and the resin composition described in the present invention can also The cured product has the advantages of good heat resistance, solder dip resistance, and low water absorption.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a halogen-containing antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CE...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/3492C08K5/5313C08G59/68C08G59/62B32B15/20B32B15/14B32B29/02B32B33/00B32B37/06B32B37/10B32B27/04
CPCB32B15/14B32B15/20B32B29/02B32B33/00B32B37/06B32B37/10B32B2260/021B32B2260/028B32B2260/046B32B2307/306B32B2307/3065B32B2307/7265B32B2457/08C08G59/62C08G59/686C08L63/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/025C08K5/34928C08K5/5313
Inventor 张龙霍国洋李莎
Owner SHAANXI SHENGYI TECH
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