TPU (thermoplastic polyurethane) conveyor belt with excellent electric conductivity and process for preparing TPU conveyor belt
A technology of electrical conductivity and preparation technology, which is applied in the field of TPU conveyor belt and its preparation technology, can solve the problems of short service life and poor conductivity, and achieve the effects of prolonging service life, enhancing tensile performance and increasing stability
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Embodiment 1
[0027] A TPU conveyor belt with good electrical conductivity, comprising from top to bottom the invention of the upper surface layer 1, the invention of the skeleton layer 2, the invention of the bearing layer 3 and the invention of the lower surface layer 4, and the upper surface of the invention of the upper surface layer 1 is provided with a carbon nanoparticle layer 5 invention, which can make the conveyor belt have better conductivity and longer service life.
Embodiment 2
[0029] A TPU conveyor belt with good electrical conductivity, comprising from top to bottom the invention of the upper surface layer 1, the invention of the skeleton layer 2, the invention of the bearing layer 3 and the invention of the lower surface layer 4, and the upper surface of the invention of the upper surface layer 1 is provided with a carbon nanoparticle layer Invention 5, carbon nanoparticle layer In invention 5, the carbon nanoparticle is in the shape of a three-dimensional mesh honeycomb, and the particle size is 2 μ, which has good conducting properties.
Embodiment 3
[0031] A TPU conveyor belt with good electrical conductivity, comprising from top to bottom the invention of the upper surface layer 1, the invention of the skeleton layer 2, the invention of the bearing layer 3 and the invention of the lower surface layer 4, and the upper surface of the invention of the upper surface layer 1 is provided with a carbon nanoparticle layer Invention 5, the carbon nanoparticle layer 5 invention, the upper surface layer 1 invention, the skeleton layer 2 invention, the bearing layer 3 invention and the lower surface layer 4 invention are bonded by glue, and the processing and preparation are more convenient through bonding.
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