Unlock instant, AI-driven research and patent intelligence for your innovation.

Miniaturized double-layer substrate integrated waveguide six-port device

A substrate-integrated waveguide and six-port technology, applied in the microwave field, can solve the problems of limiting the application range of six ports, large volume, and difficulty in integration, and achieve the effects of compact structure, large working bandwidth, and reduced processing difficulty

Active Publication Date: 2021-06-08
NANJING UNIV OF POSTS & TELECOMM
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a transceiver in a communication system, the six-port is also widely used in various modulation and demodulation systems, but the traditional waveguide six-port device has a three-dimensional structure, large volume, and is not easy to integrate, and the traditional substrate The integrated waveguide six-port device is also mainly a single-layer circuit board. This structure has the same shortcomings as above, and these shortcomings greatly limit the scope of application of the six-port

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Miniaturized double-layer substrate integrated waveguide six-port device
  • Miniaturized double-layer substrate integrated waveguide six-port device
  • Miniaturized double-layer substrate integrated waveguide six-port device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Miniaturized double-layer substrate integrated waveguide six-port device, Figure 1-Figure 3 As shown, it includes a top layer dielectric substrate 2, a bottom layer dielectric substrate 4, and an intermediate layer metal layer 3 arranged between them that are stacked and attached to each other. The upper surface of the top layer dielectric substrate 2 is provided with a top layer metal layer. 1. The lower surface of the underlying dielectric substrate 4 is provided with an underlying metal layer 5;

[0033] Among them, the top dielectric substrate 2 and the bottom dielectric substrate 4 are provided with multiple groups of metallized through holes, and the metallized through holes on the top dielectric substrate 2 are connected with the top metal layer 1, the top dielectric substrate 2 and the middle layer metal layer. Layer 3 constitutes the first substrate integrated waveguide; the metallized through hole on the bottom dielectric substrate 4, the bottom metal layer 5...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
frequencyaaaaaaaaaa
Login to View More

Abstract

The invention discloses a miniaturized double-layer substrate integrated waveguide six-port device, which includes a top layer dielectric substrate, a bottom layer dielectric substrate and a middle layer metal layer that are stacked and attached to each other, and the upper surface of the top layer dielectric substrate is provided with a top layer The metal layer, the lower surface of the bottom dielectric substrate is provided with the bottom metal layer; the top dielectric substrate and the bottom dielectric substrate are provided with two groups of mutually symmetrical metallized through holes, and the metallized through holes are connected with the top metal layer and the top dielectric substrate. The first substrate integrated waveguide is formed by the chip and the middle layer metal layer; the second substrate integrated waveguide is formed by the metallized through hole and the bottom metal layer, the bottom dielectric substrate and the middle layer metal layer; three ports are arranged on the top layer metal layer and set There are a plurality of complementary split resonant rings; two rows of mutually symmetrical round holes are opened on the metal layer of the middle layer; three ports are arranged on the bottom metal layer. The invention has the advantages of simple design structure, wide six-port stable output working bandwidth, compact structure, reduced processing difficulty and cost, and reduced volume.

Description

technical field [0001] The invention relates to a miniaturized substrate-integrated waveguide device, in particular to a miniaturized double-layer substrate-integrated waveguide six-port device, which belongs to the field of microwave technology. Background technique [0002] Six-port technology was first used to measure the complex reflection coefficient of microwave circuits. With the further development of science and technology, six-port devices have been more widely used in power measurement systems and receiver systems. The performance of the six ports directly affects the accuracy of the entire measurement system, especially in some precision measurement systems such as cosmic microwave background radiation, any improvement in the performance of the device will greatly improve the accuracy of the entire system. As a transceiver in a communication system, six ports are also widely used in various modulation and demodulation systems, but the traditional waveguide six-po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/12H01P3/18
CPCH01P3/18H01P5/12
Inventor 许锋刘水
Owner NANJING UNIV OF POSTS & TELECOMM
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More